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Fluid jet device

A fluid injection and fluid technology, which is applied in the direction of injection device, injection device, semiconductor/solid device manufacturing, etc., can solve the problem that the fluid cannot be injected, and achieve the effect of reducing the size of the nozzle and preventing it from being untreated

Active Publication Date: 2008-05-28
WEIHAI DMS OPTICAL ELECTROMECHANICAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the existing fluid ejection device, when the fluid is ejected through the nozzle K, the surface tension is generated due to the attractive force between the molecules constituting the fluid, which causes the fluid to incline at a certain angle θ toward the inner side of the substrate.
[0008] Therefore, the prior art has the problem that the fluid cannot be sprayed to the edge E of the substrate.

Method used

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Embodiment Construction

[0022] Next, the structure of the fluid ejection device of the present invention will be described in detail with reference to the drawings.

[0023] At first, Fig. 2 is a perspective view of a nozzle of a fluid ejection device in a preferred embodiment of the present invention, Fig. 3 is a schematic diagram showing the bottom structure of the nozzle in the fluid ejection device shown in Fig. 2, and Fig. 4 is the fluid injected by the nozzle shown in Fig. 2 State diagram.

[0024] As shown in FIG. 2 , the fluid ejection device 1 of the present invention may be disposed above a substrate G conveyed by conveying rollers R. As shown in FIG.

[0025] The fluid ejection device 1 comprises: a nozzle 2, which has a discharge port 5 for spraying a fluid W onto the substrate G; a guide device, which is arranged at both ends of the discharge port 5 of the nozzle 2, for guiding the injection of the fluid Direction, so that the fluid W ejected from the discharge port 5 is evenly sprayed ...

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Abstract

The invention relates to a fluid injection device comprising a nozzle having an outlet opening used to spit fluid towards the substrate, and a guide apparatus mounted on the injection-side end of the nozzle for guiding the fluid injected from the outlet opening, so that the fulid can be injected uniformly on the whole surface of the substrate. The fluid injection device is increased in the treatment efficiency of the substrate by the improved nozzle structure allowing the fluid to be injected vertically.

Description

technical field [0001] The present invention relates to a fluid ejection device, in particular to a fluid ejection device which guides the fluid to be ejected in a vertical direction through an improved structure, so that the fluid can be ejected on the entire surface of the substrate, thereby improving the processing efficiency of the substrate. Background technique [0002] Generally, a fluid ejection device is a device that ejects a fluid such as a chemical solution onto the surface of a substrate. Such a fluid ejection device can be applied in various fields according to its use. [0003] That is, it can be applied to various devices such as a coating device that applies a chemical solution to a substrate to form a coating layer, or a cleaning device that sprays a cleaning liquid to remove impurities on a substrate. [0004] Fig. 1 is a schematic diagram of the structure of a nozzle in a conventional fluid ejection device. [0005] As shown in FIG. 1 , a nozzle K of a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B1/26B05B15/04
CPCH01L21/67017
Inventor 金银洙
Owner WEIHAI DMS OPTICAL ELECTROMECHANICAL CO LTD