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Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket

A circuit substrate and semiconductor technology, applied in semiconductor/solid-state device components, semiconductor devices, printed circuits connected with non-printed electrical components, etc., can solve problems such as impact and solder melting

Inactive Publication Date: 2009-11-11
ADVANCED SYST JAPAN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the above-mentioned semiconductor package has a problem that when laminating multiple layers of the above-mentioned semiconductor devices and bonding them to achieve electrical conduction, high-temperature heating is required to melt the solder, and this heating affects the already-bonded parts.

Method used

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  • Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
  • Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
  • Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket

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Embodiment Construction

[0059] A semiconductor package having a socket function, a semiconductor module, an electronic circuit module, and a circuit board with a socket of the present invention will be described with reference to the accompanying drawings.

[0060] figure 1 (a) a plan view of the semiconductor package of the present embodiment, figure 1 (b) is the edge figure 1 (a) A cross-sectional view of a semiconductor package taken along the line A-A, with conical spiral contacts. figure 1 (c) is the edge figure 1 (a) A cross-sectional view of a semiconductor package taken along line A-A, with horizontal spiral contacts.

[0061] like figure 1 As shown in (a), a plurality of sockets 1, 1' having spiral contacts 1a, 1a' are formed on the upper surfaces 3a, 3a' of the semiconductor packages 3, 3'.

[0062] like figure 1 As shown in (b), the semiconductor package 3 has a socket 1 formed on the upper surface 3a of the semiconductor package 3 to enable electrical conduction and a connect...

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Abstract

A semiconductor package (3) comprises a socket (1) formed on the upper surface (3a) for enabling an electrical connection, and a connection terminal (2) formed on the lower surface (3b) for enabling an electrical connection. The socket (1) has a hollow shape, a spiral contact (1a) is arranged in the hollow portion (1c), and the spiral contact 1a is projected like a cone from the bottom face (1b) of the hollow portion (1c) to the upper part. An electric circuit module is configured by loading a semiconductor module configured by laminating a plurality of semiconductor packages (3) on a circuit board, and connecting them with electric conduction. Also, a circuit board with a socket is configured by loading a socket substrate on the circuit board.

Description

technical field [0001] The present invention relates to a semiconductor package having a socket function, a semiconductor package in which a plurality of the semiconductor packages are stacked up and down, and / or a plurality of the semiconductor packages are arranged left and right, an electronic circuit package constructed by mounting the semiconductor package on a circuit board, and a tape socket circuit board. Background technique [0002] Conventionally, as an example of a structure of a stacked-type stacked semiconductor device, a stacked-type semiconductor device is known in which a plurality of semiconductor devices are stacked and bonded using connection terminals formed of solder balls provided on the bottom surface of a thin semiconductor device package. . For the stacked semiconductor device having the above-mentioned structure, refer to US Patent No. 6,303,997 (see pages 5 to 6, image 3 )Be explained. Figure 17 It is a structural diagram of the above-mentione...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/10H01L23/12H01L23/28H01L23/32H01R13/24H05K1/18
CPCH01L2924/0002H01L2924/15311H01L2224/16225H01L2224/16145
Inventor 平井幸广
Owner ADVANCED SYST JAPAN INC