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Rigid and flexible circuit board and production method therefor

A flexible circuit board, non-flexible technology, applied in the direction of printed circuit, printed circuit, multi-layer circuit manufacturing, etc., can solve the problem of low connection reliability of the electroplating connection part, and achieve the effect of high reliability

Inactive Publication Date: 2009-11-11
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the connection reliability of the plated connection part is low

Method used

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  • Rigid and flexible circuit board and production method therefor
  • Rigid and flexible circuit board and production method therefor
  • Rigid and flexible circuit board and production method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] Next, a flex-rigid wiring board 10 according to an embodiment of the present invention will be described.

[0050] Such as Figure 1A and 1B As shown, the flex-rigid wiring board 10 according to the embodiment of the present invention is composed of a first rigid substrate (rigid substrate) 11, a second rigid substrate 12, and a flexible substrate (flexible substrate) 13 connecting the rigid substrates 11 and 12.

[0051] Arbitrary circuit patterns can be formed on the first rigid substrate 11 and the second rigid substrate 12 . In addition, electronic components such as semiconductor chips and the like may be connected as needed.

[0052] Stripe wiring 13 a for connecting the circuit patterns of the first rigid substrate 11 and the second rigid substrate 12 is formed on the flexible substrate 13 . The wiring 13a connects the circuit patterns of the rigid substrates 11 and 12 to each other.

[0053] Next, taking the junction of the rigid substrate 11 and the flexible s...

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PUM

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Abstract

A flexible substrate (13) having conductor patterns (132, 133), and a nonflexible base material (112) having rigidity are arranged in the horizontal direction. The flexible substrate (13) and the nonflexible base material (112) are covered with insulating layers (111, 113) to expose at least a part of the flexible substrate. Via holes (116, 141) reaching the conductor patterns (132, 133) of the flexible substrate (13) are formed on the insulating layers (111, 113), and wirings (117, 142) reaching the conductor patterns (132, 133) are formed through the via holes (116, 141) by plating. Insulating layers (114, 115, 144, 145) are laminated on the insulating layers (111, 113) to form circuits (123, 150) and the wirings are connected.

Description

technical field [0001] The present invention relates to a bendable circuit board partially composed of a flexible substrate and a manufacturing method thereof. Background technique [0002] For example, Patent Documents 1 to 3 disclose rigid-flex wiring boards in which a part of the substrate is rigid and the other part is flexible. [0003] The flex-rigid wiring board disclosed in Patent Document 1 has a core substrate with a rigid portion, a flexible substrate arranged adjacent to the core substrate in the horizontal direction of the core substrate, and a flexible adhesive laminated on the core substrate and the flexible substrate. The adhesive layer, the wiring pattern formed on the flexible adhesive layer located in the rigid part, and the blind holes and / or through holes formed to connect the wiring patterns of the respective layers. [0004] In this configuration, a flexible adhesive layer is laminated on the flexible substrate. Therefore, the stress becomes large wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4652H05K2201/09563H05K2201/0187H05K2201/09627H05K3/4602H05K3/4644H05K2201/09509H05K3/4691H05K3/0035H05K2201/096H05K2201/09127H05K3/46H05K1/02
Inventor 高桥通昌青山雅一
Owner IBIDEN CO LTD