Fastener module and heat radiating device having the same

A technology of heat dissipation device and fastener, applied in elastic/clamping device, circuit arrangement on support structure, cooling/ventilation/heating transformation, etc., can solve problems such as interference, and achieve the effect of low product height

Inactive Publication Date: 2009-12-23
PEGATRON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Another object of the present invention is to provide a heat dissipation device to solve the problem that the fastener module easily interferes with the electronic components around the heat sink when the heat sink is assembled on the heat source

Method used

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  • Fastener module and heat radiating device having the same
  • Fastener module and heat radiating device having the same
  • Fastener module and heat radiating device having the same

Examples

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Embodiment Construction

[0028] Figure 2A Is a three-dimensional view of a heat dissipation device arranged on a heat source according to a preferred embodiment of the present invention, and Figure 2B for Figure 2A Exploded view of the heat sink and heat source. Please also refer to Figure 2A versus Figure 2B The heat dissipation structure 200 of this embodiment is suitable for dissipating a heat source 22 on a circuit board 20. The heat dissipation structure 200 includes a fixing module 210, a heat sink 220 disposed on the heat source 22, and a fastener module 230.

[0029]In this embodiment, the fixing module 210 is disposed on the circuit board 20 and surrounds the heat source 22, and the fixing module 210 has a first buckling portion 212 and a second buckling portion 214. In addition, the radiator 220 is, for example, an extruded radiator or other appropriate type of radiator, and the fastener module 230 is spanned across the radiator 220 and is fastened to the first fastening portion 212 and th...

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PUM

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Abstract

The invention discloses a buckle module and a heat dissipating device provided with the buckle module, wherein, the heat dissipating device is suitable for dissipating heat for the heat source of the circuit board. The heat dissipating device comprises a fixed module, a radiator and the buckle module, wherein, the fixed module is arranged on the circuit board and around the heat source, the radiator is deployed on the heat source while the buckle module is crossly arranged on the radiator and buckles up the fixed module. The buckle module comprises a body, a blocking part and a pressing structure. One end of the body is suitable for buckling up the fixed module and the body is suitable for pressing the radiator on the heat source. The blocking part is assembled at the other end of the body. One end of the blocking part buckles up the fixed module while the other end is provided with a guiding part which is arranged in a guiding open groove of the pressing structure in a sliding way to lead the pressing structure to be connected with the blocking part.

Description

Technical field [0001] The present invention relates to a clip module, and particularly relates to a clip module and a heat-dissipation apparatus having the clip module. Background technique [0002] In recent years, with the rapid advancement of science and technology, the transistors contained in various electronic components (such as chipsets) have become higher and higher, and the operating temperature of these electronic components has also become higher. Take the central processing unit (CPU) of a computer device as an example. As the computing speed of the central processing unit continues to increase, the heating power of the central processing unit also continues to rise. In order to prevent the central processing unit from overheating and causing temporary or permanent failure of the computer device, the computer device needs to have sufficient heat dissipation capacity to enable the central processing unit to operate normally. In order to remove the heat generated by t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/12H05K7/20H01L23/40G06F1/16
Inventor 严坤政
Owner PEGATRON
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