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A method for model based geometry decomposition for use in a multiple exposure process and corresponding product

A multi-exposure and sub-exposure technology, which is used in microlithography exposure equipment, photolithographic process exposure devices, special data processing applications, etc.

Inactive Publication Date: 2009-12-30
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, for some target patterns, it is not possible to obtain k 1 <0.25
[0012] Another problem associated with current decomposition algorithms is that these algorithms are primarily rule-based algorithms that require a large number of rules to handle today's increasingly complex designs
Also, within a design for which no rules have been defined, multiple situations / conflicts often exist and these situations can cause the algorithm to fail to find a suitable result

Method used

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  • A method for model based geometry decomposition for use in a multiple exposure process and corresponding product
  • A method for model based geometry decomposition for use in a multiple exposure process and corresponding product
  • A method for model based geometry decomposition for use in a multiple exposure process and corresponding product

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Embodiment Construction

[0038] As explained in more detail below, the model-based shading process breaks down the target pattern into segments that are independently illuminated during multiple exposures. In one embodiment, multiple segments are allocated and included in one of two separate reticles that are subsequently illuminated. Furthermore, as shown in the examples disclosed herein, the model-based shading process automatically provides, when necessary, to decompose individual geometric structures (ie, features) in the target pattern into Image multiple segments.

[0039] see figure 1 ,Should figure 1 is an exemplary flowchart of a model-based shading process, the first step in the process (step 10) is to define the target pattern (i.e., the pattern to be imaged on the substrate) and the illumination setup that will be used to image the target pattern . The target pattern is preferably described in a data format, such as "gds", which is a standard data format. However, any other suitable d...

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Abstract

A method of decomposing a target pattern having features to be imaged on a substrate so as to allow said features to be imaged in a multi-exposure process. The method includes the steps of: (a) segmenting a plurality of the features into a plurality of polygons; (b) determining the image log slope (ILS) value for each of the plurality of polygons; (c) determining the polygon having the minimum ILS value, and defining a mask containing the polygon; (d) convolving the mask defmed in step (c) with an eigen function of a transmission cross coefficient so as to generate an interference map, where the transmission cross coefficient defines the illumination system to be utilized to image the target pattern; and (e) assigning a phase to the polygon based on the value of the interference map at a location corresponding to the polygon, where the phase defines which exposure in said multi-exposure process the polygon is assigned.

Description

technical field [0001] The technical field of the invention relates generally to a method, program product, and apparatus for performing model-based decomposition on a target pattern to allow the target pattern to be imaged, eg, with multiple masks in multiple illumination passes. Background technique [0002] This application claims the benefit of U.S. Patent Application Serial No. 60 / 754,312, filed December 29, 2005, and U.S. Patent Application Serial No. 60 / 776,199, filed February 24, 2006, Both patent applications are hereby incorporated by reference in their entirety. [0003] A lithographic apparatus may, for example, be used in the manufacture of integrated circuits (ICs). In this case, the mask may contain a circuit pattern corresponding to the individual layers of the IC, and this pattern may be imaged onto a substrate (silicon wafer) that has been coated with a layer of radiation-sensitive material (resist) ( For example, on a target portion comprising one or mor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G06F17/00H01L21/027
Inventor R·J·索查
Owner ASML NETHERLANDS BV