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Method capable of adjusting sensing part lens deviation and its encapsulation structure

A sensing element and packaging structure technology, which is applied in the field of adjustable sensing element lens deviation and its packaging structure, can solve the problems of complicated formation process of controlling the height of the side wall, etc., and achieve the effect of precise lens deviation and precise adjustment

Inactive Publication Date: 2007-09-12
FOXLINK IMAGE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method requires precise control of factors such as temperature, welding area, material and amount of connection materials during the formation of the side wall, and the formation process of controlling the height of the side wall is complicated.

Method used

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  • Method capable of adjusting sensing part lens deviation and its encapsulation structure
  • Method capable of adjusting sensing part lens deviation and its encapsulation structure
  • Method capable of adjusting sensing part lens deviation and its encapsulation structure

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Embodiment Construction

[0029] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0030] Please refer to FIG. 1 , the package structure 1 of the present invention which can adjust the lens deviation of the sensing element includes a carrier substrate 10 , a photosensitive chip 20 , a light-transmitting element 30 and a frame 40 covering the elements arranged from bottom to top.

[0031] The photosensitive chip 20 is affixed to approximately the middle of the upper surface of the carrier substrate 10 . The photosensitive chip 20 is provided with a first bonding area A around the upper surface of the photosensitive chip 20 , and the carrier substrate 10 is provided with a second bonding area B around the upper surface. A plurality of metal connecting wires 21 are electrically bonded between the first bonding area A and the...

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Abstract

The invention supplies a adjustable feel measure component lens deviation method and its packaging structure. The packaging structure includes the load bearing foundation plate, sensitising chip and the translucidus component and the out frame which covered the component. The sensitising chip has the first linkage area, the load bearing foundation plate has the second linkage area, some metal connecting line separately linkages to the two linkages area. The metal connecting line includes crest line in the first linkage area from the self sensitizing chip, the top of crest line againsted the down surface of the translucidus component. This invention adjusts the altitude of the crest line through adjusting the length of metal connecting line, then adjust the relative position relations between translucidus component and sensitising chip, thus simple, fine adjust the angular deviation of lens whole relative sensitising chip including the translucidus component.

Description

technical field [0001] The invention relates to a method for adjusting the lens deviation of a sensing element and its packaging structure, in particular to a method for adjusting the lens deviation of the sensing element and its packaging structure when the sensing element is wired. Background technique [0002] With the rapid popularization of semiconductor imaging products such as digital cameras, the technology of packaging structures of image sensing chips in such semiconductor imaging products has also been rapidly developed. [0003] Generally, the above-mentioned image sensor chip packaging structure includes a carrier substrate, a photosensitive chip, and a light-transmitting element arranged from bottom to top, and sidewalls covering the exterior of these elements. Wherein, the photosensitive chip is fixed on the upper surface of the carrier substrate, the light-transmitting element is covered on the photosensitive chip, and the light-transmitting element and the o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/49H01L21/50H01L21/60H04N5/225
CPCH01L2224/4809H01L2924/01078H01L2924/01004H01L2224/48465H01L2924/09701H01L2224/48227H01L2224/85181
Inventor 廖浚男
Owner FOXLINK IMAGE TECH
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