Ultrahigh-power LED light and manufacturing method thereof

A technology of LED lights and ultra-high power, which is applied in cooling/heating devices of lighting devices, lighting and heating equipment, electrical components, etc. Small size, fast heat dissipation, and the effect of changing the structure

Inactive Publication Date: 2007-09-26
DONGGUAN CLED OPTOELECTRONIT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In order to make LED lamps adapt to the needs of general lighting, solid-state lighting sources urgently need to solve the problem of unit luminous flux. The increase of LED lamp unit luminous flux greatly increases the calori

Method used

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  • Ultrahigh-power LED light and manufacturing method thereof
  • Ultrahigh-power LED light and manufacturing method thereof
  • Ultrahigh-power LED light and manufacturing method thereof

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Embodiment Construction

[0023] The manufacturing method of the ultra-high-power LED lamp of the present invention is completed by adopting a module-type encapsulation manufacturing method, and the cup body of the high-power LED lamp and the metal substrate form an integral structure. in:

[0024] 1. Heat pipe: an important component in the present invention, which can quickly transfer the heat generated when high-power LEDs are working. One end of the heat pipe is connected to a high-power LED, and the other end is connected to a lamp housing or other radiator. The heat generated by the LED is quickly transferred to the lamp housing or radiator through the heat pipe to achieve heat dissipation. According to the load (LED heating power) and the thermal migration capacity of the heat pipe itself, the heat pipe can be composed of a single group, a double group (Figure 1, Figure 5) or multiple groups (each group of heat pipes is composed of a single or multiple heat pipes), the tube Diameter size (∮3,∮5...

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Abstract

A super power LED light comprises the super power LED light cup connected to the structure made of heat pipe base plate using module set sealed method being integral forming structure, with the heat conductive resistance close to zero, effectively solving the high conductive heat with organic silicon , effectively solving the big heat resistance of high heat conductive organic silicon and metal base, applicable for LED lamp with big power larger than 0.5 W, especially over 10 W super power LED light, with compact structure, convenient installation and significant energy saving effect.

Description

technical field [0001] The invention belongs to an LED lamp, in particular to a high-power LED lamp. Background technique [0002] As we all know, LED lamps, like traditional light sources, will generate heat during operation. LED lamps are under the action of external energy, and the radiative recombination of electrons and holes occurs in the electric effect that converts 30-35% of the energy into light energy, while The lattice vibrations that occur through non-radiative recombination convert the remaining 65-70% of the energy into heat. LED is very sensitive to temperature, and only when the working temperature is low can it obtain high and reliable optical indicators and meet the requirements of general lighting. In order to make LED lamps adapt to the needs of general lighting, solid-state lighting sources urgently need to solve the problem of unit luminous flux. The increase of LED lamp unit luminous flux greatly increases the calorific value per unit, and the large ...

Claims

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Application Information

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IPC IPC(8): F21V29/00F21V19/00H01L23/34F21V29/51F21V29/87
Inventor 陈德华欧发文
Owner DONGGUAN CLED OPTOELECTRONIT TECH
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