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Low-thermal-resistance and high-radiation metal-base circuit board

A technology of metal-based circuit boards and metal substrates, which is applied in the direction of circuit substrate materials and printed circuit components, can solve problems such as increased thermal resistance, low heat dissipation efficiency, and difficult construction, and achieves improved heat dissipation efficiency and significant energy-saving effects , the effect of easy installation

Active Publication Date: 2012-11-21
ALLSTAE TECH ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Adhesives or fastening methods are costly, short-lived and difficult to construct
Furthermore, the heat dissipated by the electrical components is conducted to the radiator by the circuit board, and the series connection increases the thermal resistance and the heat dissipation efficiency is not high.

Method used

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  • Low-thermal-resistance and high-radiation metal-base circuit board
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  • Low-thermal-resistance and high-radiation metal-base circuit board

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Embodiment Construction

[0022] A further detailed description will be made below in conjunction with the accompanying drawings and embodiments of the present invention:

[0023] see Figure 1-4 , the present invention is a metal-based circuit board with low thermal resistance and high heat dissipation, comprising a metal substrate 1, a circuit layer made of a high-insulation and low-thermal-resistance material is provided on one side of the metal substrate, and an electrical component 2 is electrically connected to the circuit layer; at least one wing of the metal substrate 3. Bending to the other side of the metal substrate that is not equipped with electrical components to form an extended heat dissipation plate 4. There is a certain gap between the extended heat dissipation plates to form a convection channel 5; a heat radiation layer 6 is provided on the extended heat dissipation plate; the metal substrate and the extension The cooling plate is integrated. Electrical components complete the ligh...

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Abstract

The invention discloses a low-thermal-resistance and high-radiation metal-base circuit board, which comprises a metal substrate, wherein a circuit layer made of a high-insulation and low-thermal-resistance material is arranged on one side of the metal substrate, and an electric component is electrically connected with the circuit layer; at least one wing of the metal substrate is bent towards theother side without the electric component of the metal substrate to form extension radiation plates, a certain gap is formed between the extension radiation plates to form a counterflow channel; thermal radiation layers are formed on the extension radiation plates; and the metal substrate is integrated with the extension radiation plates. The invention overcomes the shortcomings of the conventional technology and provides a low-thermal-resistance and high-radiation metal-base circuit board with high radiation efficiency and a simple structure.

Description

[technical field] [0001] The invention relates to a circuit board, in particular to a metal base circuit board with low heat resistance and high heat dissipation. [Background technique] [0002] With the continuous advancement of electronic technology, electronic components are increasingly miniaturized and integrated, and the heat generated during the work of electronic components is becoming more and more concentrated and the total amount is also increasing. If there is no good heat dissipation method to conduct the heat generated by the electronic components in time, the temperature inside the electronic components will gradually rise and overheat, the internal stress will increase, the performance will decrease, and the life will be shortened. It may even burn out due to overheating. Therefore, the heat dissipation of electronic components, especially power components, is a problem that cannot be ignored. [0003] The traditional circuit board is equipped with electric...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/05
Inventor 刘沛然张家骥雷思凯
Owner ALLSTAE TECH ZHONGSHAN
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