Method for manufacturing transparent conductive film cling matrix

Abstract

The invention provides a transparent conductive film forming liquid which forms transparent conductive film with even folium resistance value and transparence property. The invention also provides a manufacturing method of transparent conductive film attached base, said transparent conductive film attached base includes even folium resistance value and transparence property. Concretely, transparent conductive film forming liquid with following characters and manufacturing method of transparent conductive film attached base with the transparent conductive film forming liquid are provided, saidtransparent conductive film forming liquid is characterized in that it includes indium compound expressed with formula [1] and stannum compound expressed with formula [2], it also may includebeta- diketone compound which dissolves the indium compound expressed with formula [1] and stannum compound expressed with formula [2]: In(R1COCHCOR2)3 [1], thereinto, R1 and R2 separately expresses the alkyl or phenyl whose carbon atomicity is 1-10; (R3)2Sn(OR4)2 [2], thereinto, R3 expresses the alkyl whose carbon atomicity is 1-10, R4 expresses the alkyl whose carbon atomicity is 1-10 or acyl whose carbon atomicity is 1-10.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of December 12, 2003, an application number of 200310120293.9, and an invention titled "Transparent Conductive Film Forming Liquid and Method for Manufacturing a Transparent Conductive Film Adhesive Substrate Containing the Forming Liquid" . technical field [0002] The present invention relates to a transparent conductive film-forming liquid and a method for producing a transparent conductive film-attached substrate containing the transparent conductive film-forming liquid. Background technique [0003] Transparent conductive film (ITO film) is widely used in liquid crystal displays, electroluminescent displays, surface heaters (surface heaters), contact (タツチpanel) electrodes, solar cells, etc. by virtue of its excellent transparency and conductivity . [0004] Since transparent conductive films are so widely used in many fields, they are required to have various sh...

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Problems solved by technology

[0010] However, when the film is formed on a substrate with a curved surface or a concave-convex shape, if a physical film-forming method such as the sputtering method is used, the physical film-forming method starts to vapor-deposit and form a film from one direction of the substrate, which is very difficult. It is difficult to form a transparent conductive film with a uniform thickness on curved parts or uneven parts

Specifically, for example, when forming a transparent conductive film on a quartz fiber, when using physical film-forming methods such as sputtering, the quartz fiber must be rotated to make the film thickness uniform during film formation, but its rotational speed control is very difficult, and It is also difficult to form a transparent conductive film with a uniform film thickness

[0011] In the dipping method, one of the chemical film-forming methods, the transparent conductive film-forming liquid can be evenly coated on the substrate with a curved surface or a concave-convex shape, but in the next step of thermal decomposition and drying, it is difficult to remove evenly If solvent is used, it is difficult to form a transparent conductive film with a uniform film thickness. Therefore, it is necessary to develop a method that can form a transparent conductive film with a uniform film thickness on a substrate with a curved surface or a concave-convex shape.

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