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Master substrate and method of manufacturing a high-density relief structure

A high-density, master disk-based technology, applied in the manufacture of optical record carriers, optical recording/reproduction, instruments, etc., can solve the problems of R/RE data readout signal degradation, rough dissolution of exposure areas, etc.

Inactive Publication Date: 2007-09-26
KONINK PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another disadvantage of photoresist materials used in conventional inscription techniques is the length of the polymer chains present in the photoresist
Dissolution of exposed areas due to long polymer chains leads to rather rough sides
Especially in the case of pits (for ROM) and grooves (for pre-grooved substrates for write-once (R) and re-writable (RE) applications), this edge roughness can lead to pre-recorded Degradation of readout signal of ROM pits and recorded R / RE data

Method used

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  • Master substrate and method of manufacturing a high-density relief structure
  • Master substrate and method of manufacturing a high-density relief structure
  • Master substrate and method of manufacturing a high-density relief structure

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Embodiment Construction

[0039] Fig. 1 shows a schematic cross-sectional view of a master substrate according to the invention before processing.

[0040] Figure 2 shows a schematic cross-sectional view of a master substrate according to the invention with local interaction sites. The recording stack 100 comprises a first recording layer 10 above a second recording layer 20 . The two recording layers 10 , 20 are supported on a substrate 14 . For simplicity, some additional layers, such as an intermediate layer between the recording layers 10, 20, a metal heat dissipation layer between the substrate 14 and the second recording layer 12, and a metal heat dissipation layer between the heat dissipation layer and the second recording layer 12 The intermediate layer and the protective layer on the first recording layer 10 are not shown. To prepare the recording stack 100 in order to etch the relief structure into the recording stack 100, a focused modulated laser beam is directed onto the top layer of the...

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Abstract

The present invention relates to a recording stack for obtaining a high-density relief structure, comprising: a first recording layer (10) on top of a second recording layer (12), the recording layers being supported by a substrate layer (14), wherein, upon projecting light on the recording layers, a local interaction of the recording layers leads to marks (16) on the basis of a local change of the properties with respect to chemical agents of the recording layers. The present invention further relates to a method of manufacturing a relief structure and a method of producing an optical data carrier.

Description

technical field [0001] The invention relates to a master disc substrate and a method for manufacturing a high-density relief structure. Background technique [0002] Relief structures manufactured based on optical processes can be used, for example, as masters for mass replication of read-only memory (ROM) and pre-grooved write-once (R) and rewritable (RE) discs. Manufacturing such a master used in the duplication process is called recording. [0003] In conventional inscription techniques, a thin photosensitive layer spin-coated on a glass substrate is irradiated with a modulated focused laser beam. The modulation of the laser beam causes some parts of the disc to be exposed to the UV light, while the intermediate areas between the pits remain unexposed. As the platter rotates, the focused laser beam is gradually drawn to the outside of the platter, leaving an alternating spiral of illuminated areas. In a second step, the exposed areas are dissolved in a so-called develo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11B7/26
CPCG11B7/261G11B7/26
Inventor E·R·迈因德斯R·A·洛克
Owner KONINK PHILIPS ELECTRONICS NV