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Thin film device

A technology of thin-film devices and thin-film coils, applied in transformers, transformer/inductor components, inductors, etc., can solve problems that cannot be said to be fully satisfied and improve performance

Active Publication Date: 2007-11-14
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Conventional thin-film devices having solenoid-type thin-film coils have met the requirements from the viewpoint of miniaturization and thin thickness, but on the other hand, they have not yet fully met the requirements for performance improvement in high-frequency applications.

Method used

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Embodiment

[0045] Next, examples of the present invention will be described.

[0046] When the various performances of the thin film inductors having the solenoid-type thin film coils shown in FIGS. 1 to 6 are estimated by magnetic field analysis using the finite element method, a series of results as shown in FIGS. 9 to 13 can be obtained. . Figures 9 to 12 show the inductance Ldc (×10 -6 H), inductance L1M (×10 -6 H), the thickness ratio TB / TA dependence of the resistance Rdc (Ω), and the resistance R1M (Ω). In addition, FIG. 13 shows the thickness ratio TB / TA dependence of the Q value Q1M. Both the "inductance Ldc" and the "resistance Rdc" are values ​​calculated through static magnetic field analysis, and generally, they can be approximated by analysis values ​​in the low-frequency region of the kHz order. On the other hand, "inductance L1M", "resistance R1M", and "Q value Q1M" are all values ​​at frequency = 1 MHz.

[0047] When estimating various performances of the thin film ...

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Abstract

A thin film device is provided which is capable of improving a Q value when employing a thin film coil wound on a magnetic film. In the thin film coil wound on an upper magnetic film, the thickness (TA) of lower coil portions in between a lower magnetic film and the upper magnetic film is larger than the thickness (TB) of upper coil portions not in between the lower and upper magnetic films (the thickness ratio TB / TA<1). The crossover magnetic flux crossing over the first coil portions in between the first and the second magnetic films can be reduced than the case where the thickness (TA) of the lower coil portions is equal to or less than the thickness (TB) of the upper coil portions (the thickness ratio TB / TA>=1).

Description

technical field [0001] The present invention relates to thin film devices having a thin film coil wound on a magnetic film. Background technique [0002] In recent years, thin film devices having thin film coils have been widely used in the field of electronic equipment for various purposes. An example of such a thin film device is a circuit element having inductance, that is, a thin film inductor. [0003] As the shape of the thin film coil mounted on the thin film device, according to the requirements of miniaturization (reduction of the device area) and thin thickness (thinning of the device thickness), the spiral type is adopted. However, not only miniaturization and thickness are required The solenoid type is used for applications that are thin and require improved performance (for example, refer to Patent Document 1). In the thin-film device having the solenoid-type thin-film coil, the excitation conductor is arranged in a solenoid shape around the thin-film magnetic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F37/00H01F27/255H01F30/00
CPCH01F17/0013G11B5/17H01F2017/0066
Inventor 藤原俊康崔京九
Owner TDK CORPARATION