Light-emitting diode packaging method
A technology of light-emitting diodes and packaging methods, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of light decay, yellowing of insulating glue, and high temperature, and achieve the effect of reducing light decay rate.
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[0022] The light-emitting diode packaged according to the packaging method of the present invention includes a bracket and a light-emitting diode die, the light-emitting diode die is fixed on the holder, and a layer of polydimethyl silicone is provided on the light-emitting surface of the light-emitting diode die. Transparent medium.
[0023] The packaging process of the light emitting diode disclosed in this embodiment includes the following steps:
[0024] Step 1: Dispensing glue, that is, dispensing insulating glue into the reflector cup of the bracket.
[0025] Step 2: Bonding, that is, placing the prepared die on the support of the insulating glue.
[0026] Step 3: Baking after solidification, that is, putting the semi-finished product with solid crystal grains into a high-temperature oven for baking, so that the crystal grains are fixed and adhered to the bracket.
[0027] Step 4: Wire bonding, that is, two gold wires are drawn from the baked crystal grains on the positive a...
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