Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board and manufacturing method thereof

A wiring circuit board and a manufacturing method technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problem of failure to improve the bonding performance of the conductor pattern and the covering insulating layer, the length of the transmission path becomes longer, and the transmission characteristics deteriorate, etc. question

Inactive Publication Date: 2007-11-28
NITTO DENKO CORP
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, if the unevenness on the surface of the conductor pattern subjected to the roughening treatment is large, the length of the actual transmission path will become longer, and the transmission characteristics will be significantly deteriorated.
[0008] In addition, as described above, in the case where the insulating cover layer is formed without roughening the conductive pattern, the bonding performance between the conductive pattern and the insulating cover layer is not improved.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0055] First, the overall configuration of the printed circuit board of the present embodiment and the second to fourth embodiments described later will be described.

[0056] FIG. 1 is a perspective view showing the overall configuration of a printed circuit board according to the first to fourth embodiments.

[0057] As shown in FIG. 1 , printed circuit board 100 of the present embodiment has bent portion 100 a bent during use and non-bent portion 100 b not bent during use. In the present embodiment, the curved portion 100a is provided between the two non-bent portions 100b having different sizes.

[0058] The bent portion 100a is a bent portion or a repeatedly bent portion, and the non-bent portion 100b is a portion mounted on a semiconductor chip or the like without bending.

[0059] A plurality of (two in this embodiment) conductor patterns 2 are formed substantially parallel to the outer shape of the curved portion 100a from one non-bent portion 100b to the other non-be...

no. 2 approach

[0083] Next, a method of manufacturing printed circuit board 100 according to the second embodiment will be described.

[0084] In the second embodiment, since the steps up to forming the predetermined conductive pattern 2 on the insulating base layer 1 by the semi-additive method are the same as those of the first embodiment (the steps corresponding to FIGS. 2(a) to (d)), Its description is omitted.

[0085]FIG. 5 is a cross-sectional view showing another example of the steps from forming the conductive pattern 2 on the insulating base layer 1 to manufacturing the printed circuit board 100 . 5 shows a region D in the C-C line cross-section of printed circuit board 100 in FIG. 1 .

[0086] On the insulating base layer 1, a predetermined conductor pattern 2 is formed across the bent portion 100a and the two non-bent portions 100b. In this way, the member in which the conductive pattern 2 is formed on the insulating base layer 1 is immersed in the same treatment liquid for rou...

no. 3 approach

[0094] Next, a method of manufacturing printed circuit board 100 according to the third embodiment will be described.

[0095] In the third embodiment, after the plating resist layer 3 is formed on the insulating base layer 1, the process of forming the conductive pattern 2 on the surface of the insulating base layer 1 on which the plating resist layer 3 is not formed is different from the first Embodiment (the process corresponding to FIG.2(a)-(c)) is the same, and the description is abbreviate|omitted. Therefore, the steps from the step of FIG. 2( c ) to the manufacturing of the printed circuit board 100 of this embodiment will be described below.

[0096] FIGS. 6A and 6B are cross-sectional views showing other examples of each process from the process of FIG. 2( c ) to the production of the printed circuit board 100 .

[0097] Wherein in Fig. 6A and Fig. 6B, (A1) and (B1), (A2) and (B2), (A3) and (B3) and (A4) and (B4) respectively represent the section of different region...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A printed circuit board has a bending portion and a non-bending portion. A base insulating layer is provided over the bending portion and the non-bending portion. A plurality of conductor patterns are formed on the insulating layer. A cover insulating layer is formed on the insulating layer to cover the plurality of conductor patterns. A surface region of the plurality of conductor patterns in the bending portion is roughened.

Description

technical field [0001] The present invention relates to a printed circuit board used in various electronic devices and a method of manufacturing the same. Background technique [0002] A printed circuit board is generally produced by a semi-additive method or a subtractive method. [0003] A printed circuit board manufactured by the above-mentioned various methods generally includes a base insulating layer made of a polyimide film or the like, a conductive pattern formed on the base insulating film, and a cover insulating layer covering the conductive pattern. [0004] In the prior art, in order to improve the bonding performance of the conductive pattern and the covering insulating layer, the surface of the conductive pattern is roughened (for example, referring to Japanese Patent Laid-Open No. 2001-36219 and Japanese Patent Laid-Open No. 2003-209351 Bulletin). [0005] By roughening the surface of the conductor pattern, the surface of the conductor pattern becomes uneven...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/38
CPCH05K1/028H05K3/108H05K3/383H05K1/0242H05K3/281H05K3/382H05K3/28H05K2201/0397H05K3/385
Inventor 本上满花园博行
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com