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Electret condenser microphone

A condenser microphone and electret technology, applied in electret electrostatic transducers, electrostatic transducer microphones, electrostatic sensors, etc., can solve problems such as poor solder soldering in reflow baths, poor microphone posture, and accumulation of thickness and size deviations. , to achieve the effect of avoiding poor solder welding

Inactive Publication Date: 2011-08-17
HOSIDEN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006]However, for the terminal electrode of the substrate 12 Figure Figure 11, even if electroplating control is performed, it will be in Fig. There is a deviation in the thickness of the shape, and the deviation of the thickness dimension of the laminated parts in the casing 2 is accumulated, and furthermore, the amount of protrusion of the curled part 13 varies depending on the processing accuracy of the curled part 13.
As a result, the terminal electrode <a href='javascript:;' class="see-img-anchor" img-id="S200680011883XE00041" img-title="Fig. The amount of protrusion of 11 is unstable, resulting in poor soldering of the reflow tank or poor posture (inclination) of the microphone on the mounting board during mounting

Method used

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  • Electret condenser microphone
  • Electret condenser microphone
  • Electret condenser microphone

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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0020] Thus, according to the microphone of the embodiment, as shown in FIG. 2 , the curled portion 13 is provided on the top plate 30 side having the sound hole 31 , and the terminal electrode of the substrate 12 is provided on the inner flange portion 21 side of the case 2 . picture Form 11. In addition, the crimp portion 13 of this embodiment does not require high precision and low height control as in the prior art, but only needs to fix the substrate 12 and components in the housing 2, and only need to apply stress that affects the deformation of the vibrating piece 4. The caulking force is sufficient, so that the conditions for forming the curled portion 13 can be reduced, and the use of the caulking jig can be facilitated.

[0021] With such a structure, the base plate 12 can be directly provided on the inner flange portion 21 . Moreover, since the wall thickness of the inner collar portion 21 is also determined by stamping or the like, even if the terminal electrodes ...

no. 2 approach

[0025] In addition, although the above-mentioned embodiment has only described the casing 2 made of metal, it is not intended to limit the casing material to metal only. For example, a synthetic resin may be used as the material of the housing 2 and electrical conductivity may be ensured by performing plating or the like on the inner wall surface of the housing 2 .

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Abstract

An electret condenser microphone where a substrate (12) and parts stacked on the substrate (12) are fixed in a capsule (2) that is made in a tubular form. The electret condenser microphone has a top plate (30) having a sound hole (31), a terminal electrode pattern (11) is provided on the substrate (12), the capsule (2) has an inner flange section (21) projecting inward into the electret condensermicrophone and an inwardly bent curl section (13), the substrate (12) is placed on the inner flange section (21), the terminal electrode pattern (11) projects outward from the inner flange section (21), and the top plate (30) is placed at the curl section (13).

Description

technical field [0001] The invention relates to an electret condenser microphone which prevents poor welding of solder and inclination of the microphone during installation. Background technique [0002] FIG. 4 shows an example of a conventional electret condenser microphone. This electret condenser microphone has a structure in which a vibrating element ring 3, a vibrating element 4, a spacer 5, and a back surface are sequentially stacked in a direction away from the sound hole 1 in a bottomed metal cylindrical case 2 having a sound hole 1. The pole 6, the back pole frame 7, the gate ring 8, the substrate 12 and other components are connected by riveting the end of the housing 2 to the ground electrode of the substrate 12 located at the upper end of the component. picture A crimped portion (riveting portion) 13 is formed on the shape 14, and the above-mentioned components are fixed into one body. The substrate 12 is provided with wires inside the electret condenser microp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/01H04R19/04
CPCH04R19/016H04R19/04
Inventor 山本明佐伯真一杉森康雄
Owner HOSIDEN CORP