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Plate heat exchanger and heat pump device equipped with same

A technology of plate heat exchanger and heat exchange part, which is applied in the directions of heat exchange equipment, heat exchanger fixing, heat exchanger type, etc., to achieve the effect of detecting poor welding

Active Publication Date: 2021-10-26
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent Document 1 is a technology for preventing damage to plate heat exchangers due to icing, but it is a technology that targets regular finished products that have been welded normally, and is not a technology that can detect icing due to poor welding

Method used

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  • Plate heat exchanger and heat pump device equipped with same
  • Plate heat exchanger and heat pump device equipped with same
  • Plate heat exchanger and heat pump device equipped with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0029] The basic configuration of the plate heat exchanger 40 according to the first embodiment will be described.

[0030] figure 1 It is a side view of the plate heat exchanger 40 according to the first embodiment of the present invention. figure 2 It is a front elevational view of the reinforcing side panel 4 of the plate heat exchanger 40 according to the first embodiment of the present invention.

[0031] image 3 It is a front elevational view of the heat transfer plate 2 of the plate heat exchanger 40 according to the first embodiment of the present invention.

[0032] Figure 4 It is a front elevational view of the heat transfer plate 3 of the plate heat exchanger 40 according to the first embodiment of the present invention.

[0033] Figure 5 It is a front elevational view of the reinforcing side panel 4 of the plate heat exchanger 40 according to the first embodiment of the present invention. Image 6 It is a view for explaining a state in which the panel heat exchanger...

Embodiment approach 2

[0087] In Embodiment 2, an example of the loop configuration of the heat pump device 100 of the plate heat exchanger 40 will be described.

[0088] In the heat pump device 100, as a refrigerant, as described above, for example, CO is used. 2 , R410A or HC, etc. Although there is also a CO 2 Such a high pressure side becomes a refrigerant in a supercritical region, but here is described as an example of the case where R410A is used as a refrigerant.

[0089] Figure 16 A circuit configuration diagram of the heat pump device 100 according to the second embodiment of the present invention. Figure 17 its about Figure 16 The state of the refrigerant of the heat pump device 100 is shown in the Morrier line diagram. exist Figure 17 In the middle, the horizontal axis represents a specific enthalpy, the vertical axis represents the refrigerant pressure.

[0090] The heat pump apparatus 100 is sequentially connected to the refrigerant cycle by a piping compressor 51, a heat exchanger 52, an...

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PUM

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Abstract

On the assumption that, of the heat transfer plate at the front two heat transfer plates adjacent to each other in the stacking direction, is defined as a first heat transfer plate and the heat transfer plate at the rear is defined as a second heat transfer plate, a portion of the headers of the first heat transfer plate and the second heat transfer plate is provided with a non-flow passage region where the headers are in contact with each other and no fluid can pass through. The peripheral edge of the non-flow passage region of the first heat transfer plate has a protrusion that protrudes upward, and the peripheral edge of the non-flow passage region of the second heat transfer plate has a recess that is recessed downward. A space portion of the protrusion and a space portion of the recess overlap in the stacking direction to form a cavity, and the plate portions forming the cavity are provided with a communication port that allows the cavity to communicate with the outside.

Description

Technical field [0001] The present invention relates to a plate heat exchanger composed of a plurality of thermally conductive sheets and a heat pump device including the plate heat exchanger. Background technique [0002] The plate heat exchanger for heat exchange between different two fluids is a structure in which a plurality of heat conductors are laminated, and in the heat conducting plate, there is a first flow path and the second flow path. The water flowing in the first flow path is heat exchange between the refrigerant flowing in the second flow path. [0003] In such a plate heat exchanger, when the plate heat exchanger is used as an evaporator, there is a water in the plate heat exchanger to reflate, the plate heat exchanger is damaged by the expansion of water caused by iron. Question. In the past, techniques for preventing damage to the plate heat exchanger caused by iron (see Patent Document 1) were proposed. [0004] Patent Document 1: Japanese Patent No. 5805189 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D9/02F28F3/04
CPCF28F3/046F28D9/005F28D2021/0068F28D9/0037F28F3/04F28F9/0221F28F2235/00F28F2275/04
Inventor 泽田宪成
Owner MITSUBISHI ELECTRIC CORP