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Plated substrate and method of manufacturing the same

A manufacturing method and substrate technology, applied in liquid chemical plating, printed circuit manufacturing, circuit substrate materials, etc., can solve problems such as resource material consumption, achieve good precision and reduce resource consumption

Inactive Publication Date: 2008-04-09
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this method, there is a problem of consumption of resources and materials in terms of finally removing the photoresist or removing a part of the metal layer.

Method used

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  • Plated substrate and method of manufacturing the same
  • Plated substrate and method of manufacturing the same
  • Plated substrate and method of manufacturing the same

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Embodiment Construction

[0033] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[0034] 1. Manufacturing method of plated substrate

[0035] 1 to 11 are diagrams illustrating a method of manufacturing the plated substrate 100 (see FIG. 12 ) according to the first embodiment. In this embodiment, electroless plating is applied to manufacture a plated substrate.

[0036] (1) First, the substrate 10 is prepared. As shown in FIG. 1 , the substrate 10 may also be an insulating substrate. A wiring board can be manufactured by forming a metal layer on an insulating substrate by the following steps. Alternatively, the substrate 10 may also be a translucent substrate (for example, a transparent substrate) that transmits visible light. An optical element such as a polarizing plate or a retardation film can be produced by forming a metal layer on a light-transmitting substrate by the following steps.

[0037] In addition, the substrate 10 may be ...

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Abstract

A method of manufacturing a plated substrate using electroless plating to form a metal layer, the method including: forming a resin section having a predetermined pattern on a substrate; forming a catalyst layer on the resin section; and depositing a metal on the catalyst layer by immersing the substrate in an electroless plating solution to form a metal layer.

Description

technical field [0001] The invention relates to a plated substrate and a manufacturing method thereof. Background technique [0002] When forming metal wiring etc. on a board|substrate, it can form by subtractive method (subtractive method), for example. In the subtractive method, a metal layer is formed on the entire surface of a substrate, a photoresist is coated on the metal layer to form a pattern, and the metal layer is etched using the photoresist as a mask. In this method, there is a problem of consumption of resources and materials in terms of finally removing the photoresist or removing a part of the metal layer. Contents of the invention [0003] An object of the present invention is to provide a plated substrate on which fine patterns with high precision are formed and a method for manufacturing the same. [0004] The plated substrate of the present invention is a plated substrate with a metal layer formed by an electroless plating method, comprising: a resin ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14H01B13/00H05K1/05H05K3/00
CPCH05K2201/09981H05K2201/09045C23C18/2086C23C18/1893H05K3/182C23C18/1608C23C18/30H05K2203/0113Y10T428/24612Y10T428/31678
Inventor 金田敏彦木村里至降旗荣道尼子淳泽木大辅木岛健
Owner SEIKO EPSON CORP