Method and system for budget estimating circuit board soldering tin amount through BMP image file
A BMP image and circuit board technology, applied in computing, electrical digital data processing, special data processing applications, etc., can solve problems such as inability to estimate the amount of solder used, unfavorable solder preparation and budgeting costs, and difficulty in applying tin.
Inactive Publication Date: 2008-05-21
SHENZHEN SKYWORTH RGB ELECTRONICS CO LTD
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[0002] Due to the requirements of the actual production process, in the design process of the circuit board, the various pads, reinforced copper foil of the circuit, etc. are not in a regular shape, so it is necessary to accurately calculate its single area or total area to analyze its soldering process. very difficult to measure
[0003] The existing solder volume analysis is to compare the weight before and after wave soldering or SMT in the production process. This method can obtain the solder volume used in the soldering process, but its disadvantage is that it cannot be estimated before production. The amount of solder required is not conducive to solder preparation and cost budget
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[0011] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0012] In the present invention, the BMP image file corresponding to the circuit board is opened in image form and binary form through the method of estimating the amount of solder on the circuit board through the BMP image file; in the image form, the RGB value of the pixel point of the welding area is obtained; in the binary form Record the total number of pixels, and cyclically judge the number of pixels equal to the RGB value of the pixel in the welding area obtained in the image form; calculate the ratio of the number of pixels in the welding area to the total number of pixels; obtain the circu...
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The invention provides a method for budgeting the weight of soldering tin on a circuit board by BMP image file, belonging to technical field of circuit board welding, which comprises the following steps: opening the image file corresponding to the circuit board in image format and binary form; obtaining the RGB values of the pixel points in the welding area in image format; recording the total quantity of the pixel in binary form and circularly deciding the quantity of pixel points which are equal to the RGB values of the pixel points in the welding area in image format; computing the ratio of the quantity of the pixel points in the welding area and the quantity of the total pixel points; obtaining the data of circuit board and computing the total area of the welding area by the ratio of the quantity of the pixel points in the welding area and the quantity of the total pixel points; computing the weight of the soldering tin required by the welding area. The invention has the advantages of implementing conveniently, rapid and accurately, computing the total welding area of the whole circuit board conveniently due to the memory character of the BMP image and budgeting the weight of soldering tin on a circuit board before production.
Description
technical field [0001] The invention belongs to the technical field of circuit board welding, in particular to a method and system for estimating the amount of solder on a circuit board through a BMP image file. Background technique [0002] Due to the requirements of the actual production process, in the design process of the circuit board, the various pads, reinforced copper foil of the circuit, etc. are not in a regular shape, so it is necessary to accurately calculate its single area or total area to analyze its soldering process. It is not easy to measure. [0003] The existing solder volume analysis is to compare the weight before and after wave soldering or SMT in the production process. This method can obtain the solder volume used in the soldering process, but its disadvantage is that it cannot be estimated before production. The amount of solder required is not conducive to solder preparation and cost budgeting. Contents of the invention [0004] The purpose of...
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Inventor 甄幸文
Owner SHENZHEN SKYWORTH RGB ELECTRONICS CO LTD