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Signal transmission structure

A technology of signal transmission and signal pads, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as poor signal quality and achieve good signal quality

Active Publication Date: 2008-07-02
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] One of the purposes of the present invention is to provide a signal transmission structure to solve the problem of poor signal quality transmitted between two reference planes

Method used

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Embodiment Construction

[0034] Figure 2A is a side view of a signal transmission structure in a preferred embodiment of the present invention, Figure 2B It is a top view of a signal transmission structure in a preferred embodiment of the present invention. Please also refer to Figure 2A and Figure 2B , the signal transmission structure 200 of the present invention includes a first signal pad 210, a first reference plane 220 surrounding the first signal pad 210, a second signal pad 230, a second reference plane 240 surrounding the second signal pad 230, electrical connections Part 250 and conductive wall 260. In this embodiment, the second reference plane 240 is parallel to the first reference plane 220 , wherein the first reference plane 220 and the second reference plane 240 may be a ground plane or a power plane. In addition, the electrical connector 250 is connected between the first signal pad 210 and the second signal pad 220 to transmit signals, and the conductive wall 260 is connected ...

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Abstract

The invention relates to a signal transmission structure which comprises a first signal pad, a first reference plane enclosing the first signal pad, a second signal pad, a second reference plane enclosing the second signal pad, an electrical connector and a conductive wall. Wherein, the second reference plane is parallel to the first reference plane; the electrical connector is connected between the first signal pad and the second signal pad to transmit signal; the conductive wall is connected between the first reference plane and the second reference plane and encloses the electrical connector. Furthermore, the invention provides a package structure for using the signal transmission structure and a method for jointing the package structure.

Description

technical field [0001] The invention relates to a signal transmission structure, in particular to a signal transmission structure capable of preventing internal signals from being subjected to electromagnetic interference. Background technique [0002] Currently, electronic devices on the market are designed with signal transmission structures inside to transmit signals inside the electronic devices. Generally speaking, due to the high density of electronic components in the electronic device, it is easy for the signal transmission structure to generate Electromagnetic Interference (EMI) with other electronic components during signal transmission, which affects the quality of signal transmission. [0003] Taking the semiconductor industry as an example, chip (integrated circuit, IC) manufacturers usually produce high integration (high integration) by increasing chip frequency (clock), circuit density, and the number of input / output (I / O) terminals. ), multifunctional (multi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L2224/10
Inventor 周佳兴黄志亿
Owner ADVANCED SEMICON ENG INC