Embedded forming method and mold for embedded forming
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- FUJISEIKO
- Publication Date
- 2008-07-09
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to an insert molding method and a mold for insert molding. Background technique
[0002] The technique of inserting an injection molded product, that is, an insert (primary molded product) and molding it into an integrated product by secondary injection molding is well known (for example, refer to Japanese Patent Laid-Open No. 2002-347067).
[0003] However, when inserting an injection molded product, that is, an insert (primary molded product) and molding it into an integrated product by secondary injection molding, when the insert shrinks or the insert is deformed according to the shape of the final product During the product, the stress deformation of the insert will have an adverse effect on the secondary injection molded product, resulting in deformation of the secondary injection molded product. In addition, due to the shrinkage of the secondary injection molded product, cracks of the secondary injection molded prod...