Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic components test seat detection device and its detection method

A technology of electronic components and detection devices, which is applied in the direction of electronic circuit testing, measuring devices, measuring electricity, etc., and can solve the problems of increasing IC testing costs

Active Publication Date: 2010-10-13
ADVANCED SEMICON ENG INC
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this move will lead to an increase in the cost of IC testing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic components test seat detection device and its detection method
  • Electronic components test seat detection device and its detection method
  • Electronic components test seat detection device and its detection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] figure 2 It is a schematic structural diagram of a detection device for an electronic component test socket according to an embodiment of the present invention. Please refer to figure 2As shown, the detection device 300 of the electronic component test socket includes a test base 310 , a detection circuit board 320 , a depth gauge 330 and a conductive voltage block 340 . The testing device 300 of the electronic component testing socket is mainly used for testing an electronic component testing socket 400 . In this embodiment, the electronic component test socket 400 to be tested is a Johns TechSocket. The Johns Tech Socket includes a plurality of stitch units 410, and each stitch unit 410 includes an S-shaped stitch 410a and a pair of elastic strips 410b accommodated in the depression of the S-shaped stitch 410a. The original state of these pin units 410 design is that its S-shaped pins 410a are located on the same plane (i.e. coplanar), so that when the electronic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a device for detecting electronic element testing seat comprising of testing base, detecting circuit board, depth gauge and conductive briquetting. A bearing plane of detecting circuit board is set on the testing base to load electronic element testing seat to detect. The said electronic element comprises of multiple stitch units, each of which comprises of one S-shaped stitch and a pair of elastic bars set in groove of S-shaped stitches. Depth gauge set on testing base is suitable to press top of conductive briquetting, and the bottom of conductive briquettingpresses testing seat of electronic element and adjust the distance between bearing plane and top of conductive briquetting by depth gauge. Detecting circuit board is connected electrically the said stitch units to detecting state of every stitch of electronic element testing base to be measured.

Description

technical field [0001] The present invention relates to a detection device and detection method of an electronic component test socket, and in particular to a detection device and detection method suitable for detecting whether the pins of a Johns Tech test socket are coplanar and the contact resistance value of the pins method. Background technique [0002] With the continuous advancement of technology, integrated circuits (hereinafter referred to as ICs) are getting smaller and smaller, and their functions are becoming more powerful, and under the trend of system on chip (system on chip), many ICs are integrated into a single chip There are more and more opportunities and applications. Therefore, in order to test whether the IC can work normally, the active JohnsTech Socket is often used for IC testing in semiconductor testing. [0003] figure 1 It is a schematic cross-sectional view of IC testing using Johns Tech Socket. Please refer to figure 1 As shown, when perfor...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R27/02G01R31/28G01R31/00
Inventor 文秉正薛为仁李仁葵林秋诚
Owner ADVANCED SEMICON ENG INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More