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Method for manufacturing display device

A technology for display devices and transfer layers, applied in lighting devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of low luminous efficiency, short brightness half-life, etc., achieve high luminous efficiency, realize cost, good The effect of material usage and productivity

Inactive Publication Date: 2008-09-24
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, although the use of such thermal transfer printing is advantageous in the process of miniaturizing light-emitting elements, this method is accompanied by

Method used

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  • Method for manufacturing display device
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Abstract

Disclosed herein above is a method for manufacturing a display device, the method including the steps of: forming a transfer layer containing an organic light-emitting material over a support substrate by coating; heat-treating the transfer layer over the support substrate; and thermally transferring the heat-treated transfer layer over a device substrate.

Description

[0001] Cross References to Related Applications [0002] The present invention contains subject matter related to Japanese Patent Application JP 2007-072965 filed in the Japan Patent Office on Mar. 20, 2007, the entire content of which is hereby incorporated by reference. technical field [0003] The present invention relates to a method for manufacturing a display device, and more particularly, to a method for manufacturing an electroluminescent element that uses an organic electroluminescent element and that is still light-emitting even if a coating film deposition method and a thermal transfer method are applied to form its light-emitting layer. A method for a display device capable of maintaining a sufficiently high luminous efficiency and a sufficiently long luminance half-life. Background technique [0004] An organic electroluminescent element using electroluminescence of an organic material is formed by disposing an organic layer obtained by stacking a hole transport...

Claims

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Application Information

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IPC IPC(8): H05B33/10H05B33/26B41M3/12
CPCH05B33/10H01L51/56H01L51/0026Y02E10/549H01L51/0013C23C14/048Y02P70/50H10K71/18H10K71/40H10K71/00
Inventor 镜庆一松尾圭介小日向好吉松田英介
Owner SONY CORP
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