Piezoelectric device, method of actuating the same, piezoelectric apparatus, and liquid discharge apparatus
A technology of piezoelectric devices and piezoelectric bodies, applied in piezoelectric devices/electrostrictive devices, material selection for piezoelectric devices or electrostrictive devices, manufacturing/assembly of piezoelectric/electrostrictive devices, etc. , can solve problems such as inability to maintain, small strain displacement, high work efficiency, etc.
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example 1
[0156] An epitaxially grown film can be formed using a material having good lattice matching characteristics with respect to a piezoelectric thin film as a material for the bottom plate and the bottom electrode. Examples of suitable combinations of base plate / bottom electrode materials include SrTiO 3 / SrRuO 3 and MgO / Pt, an epitaxially grown film can be formed by such an appropriate combination.
[0157] The fine particle-oriented ceramic sintered body can be formed by a hot press technique, a tablet technique, or a lamination technique in which a plurality of sheets obtained by a tablet technique are laminated.
[0158] With the embodiment of the piezoelectric device 1, the first ferroelectric crystal which is a ferroelectric crystal before undergoing a phase transition is an orientation crystal. Therefore, the piezoelectric effect of the first ferroelectric substance crystal uniformly and reliably covers the entire area of the piezoelectric body 13 for the range...
example 2
[0230] TiO with a thickness of 20nm 2 Adhesion layer formed on SiO 2 / Si substrate surface. Furthermore, by using the sputtering technique, a Pt bottom electrode with a thickness of 0.2 μm was formed on TiO 2 on the surface of the adhesion layer, the TiO 2 Adhesion layer formed on SiO 2 / Si substrate surface. Thereafter, PbZr with a thickness of 2.4 μm was made by using the sputtering technique 0.46 Ti 0.42 Nb 0.12 o 3 The film is formed as a piezoelectric body on a Pt bottom electrode. Moreover, a Pt top electrode with a thickness of 0.2 μm was formed on PbZr 0.46 Ti 0.42 Nb 0.12 o 3 on the film. In this way, a piezoelectric device according to the present invention is obtained.
[0231] The obtained piezoelectric thin film was subjected to electric field application XRD measurement in the same manner as in Example 1. From this measurement, it was confirmed that the piezoelectric thin film was composed of rhombohedral crystals (first ferroelectr...
example 3
[0243] In addition to PbZr with 5.0 μm by using sputtering technique 0.44 Ti 0.44 Nb 0.12 o 3 The film was formed as a piezoelectric body on the bottom electrode and it was annealed at 650°C in an oxygen atmosphere, and the top electrode was subsequently formed on PbZr 0.44 Ti 0.44 Nb 0.12 o 3 A piezoelectric device according to the present invention was obtained in the same manner as in Example 2 except on the thin film. In this way a piezoelectric device according to the invention is obtained.
[0244] The obtained piezoelectric thin film was subjected to electric field application XRD measurement in the same manner as in Example 1. From this measurement, it was confirmed that the piezoelectric thin film is composed of polycrystals including rhombohedral crystals (first ferroelectric substance crystals) having crystal orientation characteristics in the direction when no electric field is applied, and Mixture of tetragonal crystals with a crystal orientat...
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