Position correctable bearing tray
A carrier plate and carrier area technology, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as chip edge area damage and particle contamination.
Inactive Publication Date: 2008-10-15
GRACE SEMICON MFG CORP
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- Description
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- Application Information
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Problems solved by technology
However, since the tray is as big as the chip, when the robot arm releases the chip on the tray, the movable clamp will press the chip to the fixed components around the tray, so that the edges of the chip are close to the fixed components and cause a gap between each other. Contact friction relationship, and then produce many particle issues, causing damage to the edge area of the chip
Method used
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Abstract
The invention provides a bearing plate which can correct position, comprising a chip bearing area used for bearing a chip and a plurality of correcting areas extending from the edge of the chip bearing area; the correcting areas are disconnected so as to form a plurality of notches; when permeating the correcting areas and leading the chip to be placed on the bearing plate from a mechanical arm, the bearing plate has sliding space so as to avoid particle pollution caused by friction between fixed components around the bearing plate and the chip.
Description
Adjustable carrier plate technical field The invention relates to a position-correctable carrying tray, in particular to a carrying tray for carrying chips. Background technique In the semiconductor process, it is often necessary to use a robot arm to grab the chip from a holding room for placing the chip, and then transfer the chip to the processing room, and place the chip on the carrier plate of a rotating system for processing. , and the robotic arm takes the chip out of the processing chamber. Wherein, the size of the carrier plate is the same as that of the chip, and there are multiple fixed components (finger restraint) and several movable clamps on the opposite side of the fixed component around the carrier plate to fix the chip, that is, when the robot arm wants to When placing the chip on the carrier tray, the movable clamp will open first, and after the chip is placed on the carrier tray, the movable fixture will close to fix the chip, and then the carrier tray...
Claims
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Login to View More IPC IPC(8): H01L21/687H01L21/68
Inventor 徐继六
Owner GRACE SEMICON MFG CORP