Soft roasting method

A soft-baking and substrate technology, applied in nonlinear optics, instruments, optics, etc., can solve problems such as damage to the display quality and uneven thickness of liquid crystal displays

Inactive Publication Date: 2008-10-29
AU OPTRONICS CORP
View PDF0 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since this phenomenon of uneven thickness will seriously damage the display quality of liquid c

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Soft roasting method
  • Soft roasting method
  • Soft roasting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Figures 1A-1D A schematic diagram illustrating a soft-baking method according to an embodiment of the present invention. As shown in the figure, the user can first coat the alignment liquid 120 on the glass substrate 110, and then place the glass substrate 110 on the thimble 130 of the heating plate, and use the heating plate to heat the glass substrate 110 (such as Figure 1A As shown), the alignment liquid 120 on the glass substrate 110 is dried and solidified to form an alignment film. When heating the glass substrate 110, the user can timely change the position (point P) where the thimble 130 supports the glass substrate 110, so as to prevent the alignment liquid 120 on the point P from drying too quickly, resulting in uneven thickness of the dried alignment film.

[0025] Specifically, the user can use the lifting mechanism 140 to lift the glass substrate 110 away from the thimble 130 while heating the glass substrate 110 (such as Figure 1B as shown). Next, cha...

Embodiment 2

[0028] Figures 2A-2C A schematic diagram illustrating a soft-baking method according to another embodiment of the present invention. Similarly, the user can first coat the alignment liquid 120 on the glass substrate 110, and then place the glass substrate 110 on the thimble 130 of the heating plate, and use the heating plate to heat the glass substrate 110 (such as Figure 2A As shown), the alignment liquid 120 on the glass substrate 110 is dried and solidified to form an alignment film. The difference between this embodiment and Embodiment 1 is: since the cross-sectional shape of the thimble 130 of the present embodiment presents a structure similar to a zigzag (that is to say, the root and the top of the thimble 130 are located on different vertical axes), so use Alternatively, the position where the thimble 130 supports the glass substrate 110 can be changed by rotating the thimble 130 .

[0029] Specifically, the user can use the lifting mechanism 140 to lift the glass ...

Embodiment 3

[0031] Figure 3A-3D A schematic diagram of a soft-baking method according to yet another embodiment of the present invention is shown. The difference between this embodiment and the previous embodiment is that the number of thimbles 130 on the heating plate of this embodiment is multiple, and these thimbles 130 will support the glass substrate 110 in turn (such as Figure 3A-3D As shown), in order to prevent the thimble 130 from contacting the glass substrate 110 for a long time, causing the local temperature on the glass substrate 110 to be too high.

[0032] in particular, Figure 3A-3D The thimbles 130 in the group of four perform simple harmonic motion along the direction perpendicular to the glass substrate 110, wherein the thimbles 130 of the same group have a phase difference of 90° between each other, that is to say, the thimbles 130 are according to The sequence is in contact with the glass substrate 110 . It should be understood that the above-mentioned embodimen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a soft baking method which comprises the following steps: a substrate is heated by a heating plate, wherein, the heating plate is provided with at least one thimble for supporting the substrate; when the substrate is heated, the position where the thimble supports the substrate is changed. In the invention, the position where the thimble supports the substrate is changed when heating is carried out, and the thimble is not contacted with the same position of the glass substrate for a long time; therefore, the problem of uneven film thickness after drying caused by overhigh local temperature on the glass substrate can be avoided.

Description

technical field [0001] The present invention relates to a flat display manufacturing process, and in particular to a soft-baking method for manufacturing flat displays. Background technique [0002] In liquid crystal displays, the alignment film is one of the key elements to control the display quality. The alignment film is generally on the pixel electrode, and is used to control the arrangement direction of the liquid crystal molecules and provide the required pretilt angle of the liquid crystal molecules. [0003] The traditional alignment film is manufactured using roller printing technology. The so-called roller printing technology is to use a roller to coat the alignment liquid on the glass substrate, and then dry the solvent in the alignment liquid to solidify to form an alignment film. However, this roller printing technology has problems such as difficult roller maintenance and excessive consumption of alignment fluid. Therefore, related industries have gradually r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G02F1/1337G02F1/1333
Inventor 黄郁升童元鸿戴嘉萱杉浦规生
Owner AU OPTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products