Once forming and assembling method of radiating rib and hot pipe

Abstract

The invention discloses a one-time processing, shaping and assembling method of radiating fins and heat pipes, which comprises the following steps: an annular wall and a buckle part are arranged on the pressed radiating fins; the buckle part is used for fastening a plurality of the radiating fins into a whole string, the buckle parts of the radiating fins are connected together, the top part of the lower radiating fin is arranged on the back of the upper radiating fin, and gaps are formed between the radiating fins; the whole string group of the radiating fins are placed onto a platform of a processing machine, and an actuating device is used for pushing the supporting fins of a supporting tool into the gaps from the side; finally when a pressing mechanism works, the annular wall of each radiating fin is perforated by the heat pipes, the annular wall that is provided with covering elasticity by openings on the annular wall can firmly cover the surfaces of the heat pipes that perforatethe annular wall, and after the perforating installation of the heat pipes is finished, the supporting tool and a clamping tool of the pressing mechanism are simultaneously separated from the radiating fins and the heat pipes, thus finishing the assembly of the radiating fin group and a plurality of heat pipes.

Description

technical field [0001] The invention relates to a method for assembling heat dissipation fins and heat pipes, in particular to a method for assembling heat dissipation fins and heat pipes through one-time forming. Background technique [0002] With the improvement of the computing speed of the microprocessor, the heat energy generated by the microprocessor is also relatively increased, so it is necessary to install a cooling device on the microprocessor to quickly and effectively transfer heat energy to dissipate the heat energy generated by the microprocessor. , so that the microprocessor can maintain normal operations. [0003] At present, the most common heat dissipation device on the market is to put multiple heat pipes on the entire string of heat dissipation fins, and connect the heated end of the other end of the heat pipe to a heat conduction block, so that the heat conduction block contacts the surface of the microprocessor, and the other end of the heat pipe is for...

AI Technical Summary

Problems solved by technology

[0005] Although the latter can increase the assembly speed of heat dissipation fins and heat pipes, thereby increasing production capacity, when passing through heat pipes, the heat dissipation fins are only supported by the ring wall, and when the heat pipes are squeezed from top to bottom and penetrate the heat dissipation After the fins are perforated, the ring wall is squeezed with a tool to make the ring wall contact the surface of the heat pipe. During the extrusion process, the ring wall of the heat dissipation fin is deformed or the heat pipe is deformed, resulting in a gap between the outer surface of the heat pipe and the inner wall of the ring wall. There is a gap between them, which will hinder the transfer of heat energy during heat transfer

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