Method of manufacturing printed wiring board

A technology for printed circuit boards and manufacturing methods, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of different solder bump volumes and uneven heights of solder bumps, and achieve the effect of ensuring connection.

Inactive Publication Date: 2008-12-24
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a part of the solder ball is missing, the volume of the solder bump on each connect

Method used

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  • Method of manufacturing printed wiring board
  • Method of manufacturing printed wiring board
  • Method of manufacturing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Example

[0036] first embodiment

[0037] Solder Ball Mounting Device

[0038] refer to Figure 12 A solder ball mounting apparatus for mounting tiny (less than 200 μm in diameter) solder balls 77 on connection pads of a multilayer printed wiring board will be described.

[0039] Figure 12 (A) is a block diagram showing the structure of a solder ball mounting apparatus according to an embodiment of the present invention, Figure 12 (B) is the view from the arrow B side Figure 12 (A) A side view of the solder ball mounting device.

[0040] The solder ball loading apparatus 100 includes an XYθ suction stage 114, a vertical movement axis 112, a ball alignment mask 16, a mounting cylinder (cylinder member) 124, a suction box 126, a ball removal cylinder 161, an absorption box 166, a ball removal suction device 168, Mask jig 144, moving shaft 140, moving shaft supporting guide rail 142, calibration camera 146, margin detection sensor 118, solder ball supply device 122; the XYθ su...

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Abstract

To provide a method of manufacturing a printed wiring board capable of surely forming a high solder bump on a small diameter connection pad provided in the opening of a solder resist. A solder ball (77) is molten by reflowing to form a high solder bump (78U) from the solder ball (77) installed in the upper surface opening (71). Since a distance between the solder ball (77) installed in the opening (71) and the connection pad (158P) is reduced by adjusting the thickness of a solder resist layer (70), the solder bump (78U) can be surely connected to the connection pad (158P) when the solder ball (77) is molten by reflowing.

Description

technical field [0001] The present invention relates to a method of manufacturing a printed wiring board, and more particularly, to a method of manufacturing a printed wiring board suitable for use as a package substrate for mounting IC chips. Background technique [0002] Solder bumps are used to electrically connect the package substrate and the IC chip. Solder bumps are formed by the following steps. [0003] (1) Solder is printed on the connection pads formed on the package substrate. [0004] (2) Solder balls are mounted on the connection pads on which the flux is printed. [0005] (3) Perform reflow soldering to form solder bumps from solder balls. [0006] After forming the solder bumps on the package substrate, the IC chip is mounted on the solder bumps, and the solder bumps are connected to pads (terminals) of the IC chip by reflow soldering, thereby mounting the IC chip on the package substrate. In mounting the solder balls on the connection pads, for example, ...

Claims

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Application Information

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IPC IPC(8): H05K3/34H01L21/60
CPCH01L21/4853H01L24/11H01L24/742H01L24/81H01L2224/0554H01L2224/05568H01L2224/05573H01L2224/11334H01L2224/16225H01L2224/81192H01L2224/8121H01L2224/81815H01L2924/00014H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01019H01L2924/01023H01L2924/01029H01L2924/0103H01L2924/01033H01L2924/01047H01L2924/01061H01L2924/01074H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/01084H01L2924/014H01L2924/12042H01L2924/14H01L2924/15311H01L2924/15331H05K3/3452H05K3/3478H05K2201/0191H05K2203/041H05K2203/043H01L2924/00H01L2224/05599H01L2224/0555H01L2224/0556H05K3/40
Inventor 丹野克彦川村洋一郎
Owner IBIDEN CO LTD
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