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An electronic device, a housing part, and a method of manufacturing a housing part

A technology of electronic devices and electronic components, which is applied in semiconductor/solid-state device parts, electric solid-state devices, printed circuit manufacturing, etc., and can solve problems such as not allowing additional shell components to connect shell components, and inability to form electrical connections, etc.

Inactive Publication Date: 2009-01-07
KONINK PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The problem with this known electronic device is that the technical measure disclosed in GB 2371674A does not allow the connection of an additional housing part to a stack of assembled housing parts, wherein the connection automatically establishes the connection between the additional housing part and the electronic part. or the electrical connection between the outermost housing components
Another disadvantage is that at least a portion of the electrical contacts are arranged to coincide with the connection means to provide a mechanical connection
This means that if proper mechanical contact is not established, then proper electrical connection cannot be made

Method used

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  • An electronic device, a housing part, and a method of manufacturing a housing part
  • An electronic device, a housing part, and a method of manufacturing a housing part
  • An electronic device, a housing part, and a method of manufacturing a housing part

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Embodiment Construction

[0029] The same reference numerals denote the same parts in the drawings.

[0030] Figures 1a and 1b each show two housing parts 4, 6 and two electronic components 16, 26, eg printed circuit boards, before and after assembling these parts together, respectively. The assembly comprises an electronic device 1, wherein the electronic components 16, 26 are accommodated in a housing 2 (cf. Fig. 1b). The housing parts and the electronic parts are preferably circular, while the housing parts 4, 6 are preferably symmetrical with respect to the central axis. The electronic components 16, 26 preferably comprise a printed circuit board (PCB), several electronic components 34, such as integrated circuits (ICs) or surface mount devices (SMDs) mounted on the PCB. It is convenient to use electronic components which are also circular. Alternatively, however, square elements may be used. This will be explained in more detail below.

[0031]Each housing part 4, 6 comprises contact members w...

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PUM

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Abstract

The present invention relates to an electronic device (1) which comprises a modular housing (2) comprising a plurality of stacked housing parts (4, 6) that are mechanically interconnected by connection means (8, 10), and which comprises electronic parts (16, 26) having contact portions (30, 32) for providing electrical contact between the parts, a housing part adapted to accommodate an electronic part and having contact members for providing electrical contact between the parts, which contact members comprise conductive tracks (12) provided on a first surface (14), wherein the contact members comprise conductive tracks (18) provided on a second surface (20), the tracks on the second surface of a housing part are electrically connected to the tracks on the first surface of said housing part, and the second surface faces towards the first surface of a next housing part when connected to the housing. The invention further relates to a housing part for assembling a modular housing accommodating electronic parts and to a method of manufacturing such a housing part.

Description

technical field [0001] The invention relates to an electronic device according to the preamble of claim 1 . [0002] The invention also relates to housing components. [0003] Furthermore, the invention relates to a method for producing a housing part. Background technique [0004] For example, an electronic device as described in the first paragraph is known from British patent application GB 2371674A, which discloses an electronic device comprising a lower housing part (or substrate) and an upper housing part, wherein the microelectronic elements Embedded in the lower housing part or substrate. The mechanical connection means of the two housing parts comprises respective posts and grooves which cooperate to removably form a snap connection holding the housing parts together. [0005] In a first embodiment, an electrical connection is established between the two housing parts through conductive vias, wherein the conductive vias are in electrical contact with conductive t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/02H05K1/14H05K3/36H05K5/02H01L23/10
CPCH05K2201/0999H05K7/023H05K1/144H05K1/0284H05K3/325Y10T29/49158H05K2201/09118
Inventor W·F·帕斯韦尔H·利夫卡M·奥沃克尔克
Owner KONINK PHILIPS ELECTRONICS NV