268results about "Stackable modules" patented technology

A multi-chip memory module comprises multiple standard, surface-mount-type memory chips stacked on top of each other, and a pair of printed circuit boards mounted on opposite sides of the memory chips to electrically interconnect the memory chips. Each printed circuit board has vias that are positioned to form multiple rows, with each row of vias used to connect the printed circuit board to a respective memory chip. The vias falling along the bottom-most row of each printed circuit board are also exposed and are used to surface mount the multi-chip module to pads of a memory board.

A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electronically and mechanically interconnected with another board.

A miniature, multimode, modular RF terminal includes a plurality of processing modules, where at least one of the processing modules includes an external connector for conveying an input or output RF signal. The terminal further includes a segmented coaxial analog bus comprising a plurality of multi-conductor coaxial connectors, wherein each of the multi-conductor coaxial connectors is integrated in or forms a portion of one of the processing modules, and wherein the segmented coaxial analog bus conveys RF signals between the processing module having the external connector and at least one other processing module. The modules of the terminal can be arranged in a stack, on a rigid substrate, connected via a flexible substrate or combinations thereof. The terminal supports processing of communication, navigation and sensor signals.

A semiconductor package includes an integrated circuit device on a circuit board, a mold layer covering the integrated circuit board, a dissipating plate that dissipates heat from the integrated circuit device and a thermal conductive adhesive having a thermal interface material (TIM). The dissipating plate includes at least one protrusion protruding from a peripheral portion of the bottom of the dissipating plate that is inserted into the mold layer around the integrated circuit device. The dissipating plate is primarily secured to the mold layer by the protrusion, not by the thermal conductive adhesive. The thermal conductive adhesive includes a low modulus TIM (LMTIM) that supplementally adheres the dissipating plate to the mold layer.

A tray includes a tray body, a handle, a first gear, a second gear, a linking member and a block member. The first gear is fixed on the handle and pivotally connected to the tray body. The second gear is pivotally connected to the tray body and has an engaging portion. The linking member is connected to the first gear and the second gear. The block member is fixed on the tray body and has a resilient portion. When the handle rotates with respect to the tray body to a predetermined angle in an open direction, the resilient portion is engaged with the engaging portion, so as to restrain the handle from rotating in a close direction. When the resilient portion is disengaged from the engaging portion, the handle is capable of being operated to rotate with respect to the tray body in the close direction.

A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I / F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I / F module.

The invention discloses a modularized cabinet, and the cabinet comprises a cabinet frame. The cabinet frame is formed by the combination of an upper integrated guide rail, a lower integrated guide rail, a left side plate, and a right side plate. The front of the cabinet frame is provided with a front panel, and the back of the cabinet frame is provided with a rear panel. A plurality of function modules are inserted between the upper and lower integrated guide rails. The front and back panels, the upper and lower integrated guide rails and the left and right side plates jointly form an isolation cavity, and the isolation cavity is used for the electromagnetic shielding and salt mist isolation for a function module. Cover plates are disposed above the upper integrated guide rail and below the lower integrated guide rail. Cooling channels are formed between the cover plates and the upper and lower integrated guide rails, and are used for the circulating of cooling air flows, so as to cool the function module.

An electronics module includes a housing having four sides and defining an axis extending from a front to rear of the housing. Each side defines a mating feature that engages a mating feature of another electronics module. One side defines a pin-receiving receptacle, another defines a recess extending partially through a width or a thickness of the housing; and another includes a catch mechanism. A latch is mounted within the recess and includes a body having top, bottom, front, rear, inner side, and outer side surfaces. The bottom or top surface defines an opening to a vertical channel formed in the body. A hook extends from the rear surface and secures a catch on the other module. A spring-biased pin is received within the channel and mounted within the recess such that an end of the pin extends through the opening beyond a surface of the electronics housing.

A modular storage system and method, a module and a method of making the same include a top panel and a bottom panel, each of the top panel and bottom panel comprising first and second opposed edges, and first and second side members. Each of the first and second side members comprises: a top edge and a bottom edge, the top edges of the first and second side members being attached to the opposed edges of the top panel, and the bottom edges of the first and second side members being attached to the opposed edges of the bottom panel; and a longitudinal attachment feature running along a length of the side member along a longitudinal axis of the side member, longitudinal attachment features of first and second modules enabling coupling together of the first and second modules.

An accessory is provided that includes power supply module, a first functional module, and a second functional module. The power supply module can be configured to be suspended beneath an overhead support, such as a hub of an umbrella. The first functional module is configured to affix to the power supply module and to be powered by the power supply module to provide a user directed function. The second functional module is configured to be detachably coupled to either the power supply module or the first functional module to receive power from the power supply module directly or through the first functional module.

A server rack including a bottom panel, a top panel opposite to said bottom panel, a plurality of housing units configured for receiving rack-mountable equipment, the plurality of housing units being horizontally side-by-side arranged between the top panel and the bottom panel, the bottom panel comprising two support rails for supporting the server rack.

A wireless access point (AP) has a modular architecture, where each network element module provides one or more added capabilities to the wireless AP, such as devices and / or services. The modular and mechanically interlocking structure of the wireless AP enables a network user to easily expand or otherwise modify a home wireless network in a simplified manner by physically adding or removing specific network element modules. Each network element module includes the requisite power, high-speed digital signal, and module control connections in an integrated connection port, and is already loaded with suitable software for devices included in the network module element. Consequently, the network user can expand the smart network with a desired functionality by simply plugging the desired network element module into the wireless AP, and all connection and network association procedures are carried out automatically.

A mechanical assembly in a drawer may include a handle rotationally coupled to a cover and configured to rotate between a closed position and an open position relative to the cover. The mechanical assembly may also include a spring latch mechanically coupled to the cover and having a spring force for maintaining the spring latch in a biased position in the absence of mechanical force opposing the spring force, the spring latch having its most significant dimension in a direction perpendicular to a direction of translation of the drawer when the drawer is inserted and removed from a corresponding chassis. The mechanical assembly may further include a cam mechanically coupled to the handle and responsive to rotational motion of the handle such that in the closed position of the handle, the spring latch is in its biased position, and as the handle is rotated between the closed position and the open position, the cam causes the spring latch to deflect from its biased position in a direction perpendicular to the direction of translation.

The invention relates to a functional component, a method for controlling a functional component and a terminal, belonging to the field of mobile devices. The functional module includes a magnetic moving structure and a functional module. The magnetic moving structure includes a fixed part, a moving part and a magnetic part. The moving part is used for moving along a specified trajectory on the fixed part, and is connected with the functional module. The magnetic part includes a first magnet arranged on the fixed part and a second magnet arranged on the moving part, wherein one of the first magnet and the second magnet is an electromagnet, and the other is a magnet. According to the invention, the moving part to which the functional module is fixed is enabled to move along a specified trajectory on the fixed part through the magnetic part consisting of an electromagnet and a magnet, and thus, can drive the functional module to move. The problem in the related technology that it may bedifficult for the functional module to move normally after long-time use is solved. In the invention, the functional module can still move normally after long-time use.

A multi-stack storage module board assembly includes a host board having an electric connector, multiple brackets mounted on the host board and fastened to one another in a stack, multiple multimedia storage devices respectively mounted in the brackets, and adapter modules mounted on support arms in the brackets to electrically connect the multimedia storage devices to the connector of the host board. Each adapter module has a first connector, which receives one multimedia storage device, a second connector connectable to the connector of the host board, and a third connector for receiving the second connector of another adapter module.

A method and apparatus for supporting within a chassis enclosure a plurality of microprocessors, each operably coupled to a heat sink, includes mounting within the chassis enclosure one or more retention brackets, each retention bracket adapted to receive at least one microprocessor and a cover engaged about the top of at least one microprocessor, the cover being releasably fastenable to the retention bracket, and further including the coupling together of multiple retention brackets to form a bridge-like assembly.

The present invention is directed toward methods and systems for providing a stackable connector system comprising a switching device configured to select a signal based on a location of a first circuit board above or below a second circuit board. A sense line may be coupled to a location signal and configured to indicate if the first circuit board is above or below the second circuit board. Additionally, a first connector, including a first conductor element, may be located on the first circuit board and a second connector, including a second conductor element, may be located on the first circuit board. An electrical connection element on the first circuit board mat connect the first conductor element to the second conductor element, wherein the location of the first conductor element in the first connector is offset relative to the location of the second conductor element in the second connector.

An electronic device assembly structure comprises two electronic devices and a fastening unit. Each electronic device includes a body and an electric connection module. The body has at least one opening formed thereon. The electric connection module is located in the body. The fastening unit fastens the two electronic devices together in an integrated manner. The electric connection modules of the two electronic devices form electric connection through the opening.

A positive-electrode connecting plate (66) that connects positive-electrode terminals (28, 36, 48) of a plurality of power converter circuits is provided with slits (100, 102). The positive-electrode connecting plate has a positive-electrode bus bar portion (78) on which a first inverter corresponding region (94) that is connected to the positive-electrode terminal (36) of a first inverter as one of the power converter circuits via a positive-electrode connecting piece (80a), a second inverter corresponding region (96) that is connected to the positive-electrode terminal (48) of a second inverter as one of the power converter circuits via a positive-electrode connecting piece (80b) and a boost converter corresponding region (98) that is connected to the positive-electrode terminal (28) of a boost converter as one of the power converter circuits via a positive-electrode connecting piece (80c) are defined. The slits extend from an edge (82) of the positive-electrode bus bar portion along the boundaries between the regions.

A capacitor element includes a plurality of flexible base material layers that are stacked upon each other, and conductor patterns that are provided on the flexible base material layers and that define a capacitor. The capacitor element also includes a flexible portion, and a rigid portion having a larger number of stacked flexible base material layers than the flexible portion. Conductor pattern pairs that define the capacitor are provided in both the flexible portion and the rigid portion. The conductor pattern pair that is provided in the rigid portion is connected in series with the conductor pattern pair that is provided in the flexible portion. The conductor pattern pair that is provided in the rigid portion has a larger number of tiers than the conductor pattern pair that is provided in the flexible portion.

The present embodiment relates to a DC-DC converter comprising: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower plate of the housing. The flow path comprises an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part wherein the surface area of the vertical cross section of the flow path is the biggest and the part wherein the surface area of the vertical cross section of the flow path is the smallest is 10% or less.

The invention provides a digital signal processor, including a housing, a cover plate, a printed board assembly and a low frequency cable. The printed board assembly is composed of a signal processing circuit board, a power supply circuit board, an interface circuit board, an upper stud, a middle stud and a pillar stud. The signal processing circuit board, the power circuit board and the interface circuit board are arranged in a cascading way from top to bottom. The digital signal processor adopts the circuit board stacked installation way, occupies small space, reduces the equipment volume, and has a compact structure. The circuit boards are connected by using board connectors, so that the connection path is short, the loss is reduced, and the product performance, index and reliability are improved. Three layers of the circuit boards indirectly form a whole through the studs and the pillar, and after being debugged and qualified, the whole is installed in the housing for fastening. For repair or troubleshooting, simply removal of screws on the reverse side is only needed, and the entire printed board assembly can be taken out of the housing, thereby greatly improving the operability of the equipment and enabling installation and maintenance to be convenient.

The present disclosure provides an electrical module and a modular building system including electrical modules. The electrical module includes a housing member including N pin portions and a connecting portion that connects the N pin portions, where N is greater than 1; N conduction members unconnected with each other; and N magnetic members. Each pin portion is a plate having a through-hole towards its thickness direction, and corresponds to one conduction member and one magnetic member. Each conduction member includes: a first part electrically connected with a lead of an electrical component; and a second part electrically connected with the corresponding magnetic member. Each magnetic member fills the through-hole of the corresponding pin portion, and establishes magnetic connection with a magnetic member of another electrical module in thickness direction to allow the two electrical modules to contact and rotate against each other using a contacting point as a rotation pivot.

Mounting apparatus includes an enclosure, a tray, and a securing member. The enclosure includes a side plate, and a fixing portion is defined in the enclosure. The tray secures a first storage device and is slidable in a first direction that is substantially parallel to the side plate to engage with the side plate. The securing member includes a first limiting portion and a securing portion. The first limiting portion is engaged with the tray, and the securing portion is engaged with the fixing portion to prevent the first limiting portion from disengaging from the tray.

The invention relates to a small-spacing LED (light-emitting diode) display screen, in particular to a multilayer magnetic type front-maintenance small-spacing LED display screen, belonging to the technical field of LED equipment. The display screen disclosed by the invention structurally comprises an area array driver board containing LEDs; the periphery of the area array driver board is provided with cushion blocks at fixed intervals; the area array driver board is fixedly connected with a first installation plate of a center fixing iron plate to form a module; the module is combined with a second installation plate by means of a magnetic force to form an outer layer magnetic structure; the second installation plate is combined with a box or installation member by means of a magnetic force to form an inner layer magnetic structure; the magnetic force of the outer layer magnetic structure is less than that of the inner layer magnetic structure; the box or installation member adsorbs a module component composed of at least two modules by means of a magnetic force. The display screen disclosed by the invention has the advantages that the problem of tiny drift and extruding of a magnetic module with a small magnetic force after the magnetic module is installed is solved, and the problem that the planeness and module gap cannot be adjusted caused by the fact that the module is fixed on a box or installation member is solved; and the display screen is convenient to assemble and disassemble.