67results about "Stackable modules" patented technology

A data logger comprising a sensor interface for connecting at least one sensor or actuator to the data logger; an accessible memory (SD card) for storing data received from said at least one sensor or actuator; and a controller for controlling operation of the data logger wherein said data logger comprises a plurality of modules, each module having a housing electrically and mechanically connectable to a housing of an adjacent module; and wherein at least one module comprises the sensor interface and acts as a logging and / or actuation module (LAM) including at least a portion of said accessible memory (SD card); and at least one module connected to said at least one LAM acts as a control and communications module (CCM) and comprises the controller that controls communications within and external to the data logger.

A parallel module driver is disclosed and includes a modular backplane structure, a rectifier module and an inverter module. The modular backplane structure includes a plurality of connectors arranged equidistantly in a first direction. The rectifier module includes a rectifier-connection slot connected to one of the plurality of connectors in a second direction. The inverter module includes an inverter-connection slot connected to one of the plurality of connectors in the second direction. The rectifier module and the inverter module are arranged adjacent to each other, the rectifier-connection slot and the inverter-connection slot are connected to two adjacent connectors on the modular backplane structure, respectively. The lateral sides of the rectifier module and the inverter module are attached to each other, and respectively include a guiding element and a guiding groove matched with each other and limiting the rectifier module and the inverter module to slide in the second direction.

An electronic casing includes a box including a first part and a second part, each part forming a distinct container, such that a first electronic board is housed in the first part and such that a second electronic board is housed in the second part, the two parts being integral with one another by a conduit shaped to form an air circulation channel, the casing comprising at least one first connector linked to the first electronic board and at least one second connector linked to the second electronic board, the two connectors being in contact with one another through the conduit.

A power supply module is provided for powering an integrated circuit chip located at a first side of a first carrier board, including: a first-stage power supply unit; and a second-stage power supply unit, where one or more power input terminals of the second-stage power supply unit is electrically connected with one or more corresponding power output terminals of the first-stage power supply unit through a second carrier board; the second carrier board is configured to transmit power from the first-stage power supply unit to the second-stage power supply unit, and the second-stage power supply unit further supplies the power to the integrated circuit chip; one or more power output terminals of the second-stage power supply unit is electrically connected with one or more corresponding power terminals of the integrated circuit chip.

A modular control unit (100) is adaptable, in terms of interface functions, for an electric motor selected from a predetermined number i of electric motors, in particular electric motors of the same power class. The control unit (100) has at least two printed circuit boards (L1, L2), selected from a set of N different printed circuit boards (L1, L2, . . . , LN). Interface functions, electrical components, electronic components or control units for the operation of the electric motor are located on the printed circuit boards.

Embodiments of this application disclose a circuit board assembly, and are applied to the field of electronic communications technologies, to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on the second circuit board, low-speed signals transmitted between a plurality of I / O (input / output, input / output) modules and an IC (integrated circuit, integrated circuit) chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I / O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I / O modules. Therefore, there are a relatively small quantity of low-speed cables, to help airflow ventilation, so that a prior-art heat dissipation problem of a circuit board can be resolved. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

A modular surgical system is disclosed. The modular surgical system can include a control module, a first surgical module, and a second surgical module that are arrangeable in a stack. The control module can include a pulse generator to generate a clock pulse signals. Each of the first and second surgical modules can include a timing circuit and a delay circuit. Each timing circuit can receive the clock pulse signal and start a timer. A first delay circuit of the first surgical module can also receive the clock pulse signal and transmit a first delayed sequence signal to the timing circuit of the first module. A second delay circuit of the second surgical can also receive the first delayed sequence signal from the first delay circuit and transmit a second delayed sequence signal to the clock timer of the second surgical module.

The approaches presented here involve connecting network devices by routing network cable harnesses using layered transceiver panel structures and modular guides. Network cables can be connected to layered transceiver panels to transmit communications between external devices and a network switch. Modular guides can route the network cables from the layered transceiver panels, for example, in a plane perpendicular to the layer of the layered transceiver panels. The network cables connected to the layered transceiver panels and routed through the modular guides can then be connected to the network switch. The network switch can be liquid-cooled and / or air-cooled, with the airflow passing through the openings of the modular guides.

A modular arrangement is provided for housing electronic equipment and associated cooling structure in a data center environment. The modular units provide cooling air on an as—needed basis to individual pieces of equipment by way of individual plenums and associated valves. The units can be interconnected by vertical stacking, in side-to-side arrangements, and back-to-back arrangements. A number of units can be interconnected to form a cell. The cells can be interconnected to form larger units. In this manner, data centers can be configured in any desired arrangement without requiring complicated cooling design.

A vehicle includes an inverter having a power module. The power module includes a high side bus, a low side bus and an alternating current (AC) output bus. The high side bus includes a first switch, wherein a high side current is configured to flow through the first switch in a first direction. The high side bus is disposed in a plane. The low side bus includes a second switch, wherein a low side current is configured to flow through the second switch in the first direction. The low side bus is parallel to the high side bus. The alternating current (AC) output bus is parallel to the high side bus and the low side bus, wherein an output current flows through the AC output bus in a second direction opposite to the first direction.

The embodiment of the invention provides an integrated assembly, a motor controller and a power assembly. The integrated assembly comprises an integrated shell and a capacitor core, the integrated shell is used for containing the capacitor core, the integrated shell comprises a first face and a second face which are opposite in the first direction, the first face comprises two rows of fixing columns and two rows of supporting columns, each row of fixing columns comprises a plurality of fixing columns, and each row of supporting columns comprises a plurality of supporting columns. In the second direction, the multiple fixing columns in each row of fixing columns are arranged at intervals, and the multiple supporting columns in each row of supporting columns are arranged at intervals. In the third direction, the two rows of supporting columns are arranged at intervals, and the two rows of fixing columns are arranged between the two rows of supporting columns at intervals. The integrated assembly provided by the invention is high in integration level and high in compactness, parts of the motor controller can be reduced, and the size of the motor controller is reduced.

The invention relates to a method for connecting an electrical device (3) comprising the steps: - Providing an enclosed housing (1) accessible via an opening (2); - Providing a cable connection (4) to a board (5); - mechanically connecting the plate (5) to the housing (1) by closing the opening (2) with the plate (5); - Connecting the electrical device (3) to the cable connection (4) As well as a device for connecting an electrical device (3) to at least one electronic component (10) arranged in an enclosed housing (1), comprising a plate (5) with a front (8) and a back (9) and connecting elements (7) for mechanical connection to the housing (1), wherein the front (8) has a cable connection (4). Finally, the invention relates to a system comprising, among other things, such a device.

The invention discloses a bare core integrated assembly, and relates to the technical field of bare core integrated assemblies, a copper bottom plate is fixed at the lower end of a plastic shell, a DBC substrate is welded and fixed on the copper bottom plate, a chip, an NTC and a diode are welded and fixed on the DBC substrate, the DBC substrate is electrically connected with a power terminal installed on the plastic shell through a bonding wire, and the chip is electrically connected with the power terminal through a bonding wire. The plastic shell and the driving plate are connected in a nested mode, and the driving plate makes contact with a boss in the plastic shell to achieve positioning. According to the bare core integrated assembly, the self-adjusting and locking wire bar socket mechanism is adopted, so that the distance between the two conductive copper plates can be greater than the diameter of an insertion rod on the wire bar joint when the wire bar joint is inserted into the wire bar socket mechanism, thereby reducing the insertion resistance of the insertion rod on the wire bar joint and improving the insertion convenience; and after the device is assembled, the fixed self-locking of the conductive copper plate and the insertion rod on the wire bar joint can be realized, and the normal conductive effect is ensured, so that the normal operation of the device is ensured.

A sandwich structure power supply module, having: an inductor pack having at least one inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and at least one power device chip on top of the top PCB, wherein each one of the power device chips has at least one pin connected to an associated inductor via the top PCB; wherein the inductor pack is wrapped with metal layers, wherein each two metal layers are lied against to a same surface of the inductor pack, with an isolation layer in between, and wherein the two metal layers are connected to different potentials.

A modular arrangement is provided for housing electronic equipment and associated cooling structure in a data center environment. The modular units provide cooling air on an as-needed basis to individual pieces of equipment by way of individual plenums and associated valves. The units can be interconnected by vertical stacking, in side-to-side arrangements, and back-to-back arrangements. A number of units can be interconnected to form a cell. The cells can be interconnected to form larger units. In this manner, data centers can be configured in any desired arrangement without requiring complicated cooling design.

The embodiment of the present application provides an integrated assembly, a motor controller and a power assembly. The integrated assembly comprises an integrated shell and a capacitor core body, the integrated shell is used for accommodating the capacitor core body, the integrated shell comprises a first surface and a second surface opposite to each other along a first direction, the first surface comprises two rows of fixing columns and two rows of supporting columns, each row of fixing columns comprises a plurality of fixing columns, and each row of supporting columns comprises a plurality of supporting columns. Along a second direction, the plurality of fixing columns in each row of fixing columns are arranged at intervals, and the plurality of supporting columns in each row of supporting columns are arranged at intervals. Along a third direction, the two rows of supporting columns are arranged at intervals, and the two rows of fixing columns are arranged at intervals between the two rows of supporting columns. The integrated assembly provided by the present application has high integration and strong compactness, can reduce the parts of the motor controller, and reduces the volume of the motor controller.

A vertical power supply system includes a system board, a substrate, a chip unit, a plurality of first capacitors, a plurality of connection boards, a plurality of third capacitors, and a power unit. The system board includes a first surface and a second surface which are opposite to each other. The substrate includes a third surface and a fourth surface which are opposite to each other, and the third surface is located between the fourth surface and the second surface. Each of the connection boards includes a first end, a second end and a side wall. The first end and the second end are opposite to each other. The first end is electrically connected to the second surface of the system board. The second end is electrically connected to the third surface of the substrate. The chip unit is disposed on the first surface.

Embodiments of this application provide an integrated component, a motor controller, and a powertrain. The integrated component includes an integrated housing and a capacitor core. The integrated housing is configured to accommodate the capacitor core. The integrated housing includes a first surface and a second surface that are opposite to each other in a first direction. The first surface includes two rows of fastening columns and two rows of supporting columns. Each row of the fastening columns includes a plurality of fastening columns, and each row of the supporting columns includes a plurality of supporting columns. In a second direction, the plurality of fastening columns in each row of the fastening columns are arranged at intervals, and the plurality of supporting columns in each row of the supporting columns are arranged at intervals. In a third direction, the two rows of supporting columns are arranged at an interval, and the two rows of fastening columns are arranged between the two rows of supporting columns at an interval. The integrated component provided in this application has high integration and high compactness, and can reduce components and parts of the motor controller, so that a size of the motor controller is reduced.

Approaches presented herein provide for the connection of networking devices by routing network cable harnesses using layered transceiver panel structures and modular guides. Network cables can be connected to layered transceiver panels for transferring communications between external devices and a network switch. Modular guides can route the network cables from the layered transceiver panels, such as in a plane perpendicular to the plane of the layered transceiver panels. The network cables, connected to layered transceiver panels and routed through the modular guides, can then be connected to the network switch. The network switch can be liquid-cooled and / or air-cooled, with airflow passing through openings of the modular guides.

The invention discloses a power module with a sandwich structure. The power module comprises an inductor group, a PCB (Printed Circuit Board) and a power device chip which are stacked, wherein the inductor group comprises a magnetic core and a winding. The two ends of the winding are bent, then extend on the plane of the PCB and are welded to the PCB. Meanwhile, the surface of the magnetic core is covered with a metal sheet, and the metal sheet is used for being connected to a high-power pin of a power device chip through a PCB. Compared with the prior art, the power supply module has the advantages that the area on a PCB (Printed Circuit Board) can be reduced, so that the load current / power density is improved. Moreover, the power supply module transmits the output current through the pin (winding) of the inductor, so that the wiring of an output current loop on the PCB can be reduced, the high impedance of the wiring of the PCB is avoided, and the circuit efficiency is improved. In addition, the structure that the power device chip is arranged on the upper portion and the inductor group is arranged on the lower portion can greatly benefit from top cooling systems usually adopted in GPU, CPU and ASIC systems.

Power module (400) for an inverter (204), which includes: a high-side bus (406) containing a first switch (SW1) wherein a high-side current is configured to flow through the first switch (SW1) in a first direction; a low-side bus (410) containing a second switch (SW2), wherein the low-side bus (410) is parallel to the high-side bus (406) and a low-side current is configured to flow through the second switch (SW2) in the first direction; and an alternating current output bus (AC output bus) (414) which is parallel to the high-side bus (406) and the low-side bus (410), wherein an output current flows through the AC output bus (410) in a second direction which is opposite to the first direction; characterized by the fact that either the high-side bus (406) and the low-side bus (410) are coplanar to each other in a first level and the AC output bus (414) is in a second level; or the high-side bus (406) is in a first level (502), the low-side bus (410) is in a second level (504) which is parallel to the first level (502), and the AC output bus (414) is in a third level (506), wherein either (i) the second level (504) is between the first level (502) and the third level (506) or (ii) the first level (502) is between the second level (504) and the third level (506).

To provide a device, equipped with three or more circuit members overlapping one another, whose height can be reduced.SOLUTION: A device 10 comprises a first circuit member 40, a second circuit member 50, and a third circuit member 60. The first circuit member 40 has: a first main part 41 in which a main electrode 422 is formed; and a first flexible substrate 46 in which a first collective electrode part 47 is formed. The second circuit member 50 has: a second main part 51 in which a second conductive pattern is formed; and a second flexible substrate 56 in which a second collective electrode part 57 is formed. The third circuit member 60 has: a third main part 61 in which a third conductive pattern is formed; and a third flexible substrate 66 in which a third collective electrode part 67 is formed. The first collective electrode part 47, the second collective electrode part 57, and the third collective electrode part 67 overlap one another in the vertical direction. The first main part 41, the second main part 51, and the third main part 61 are separated from one another when viewed along the vertical direction.SELECTED DRAWING: Figure 4

This invention discloses a bare-chip integrated assembly, relating to the technical field of bare-chip integrated assemblies. A copper base plate is fixed to the lower end of the plastic shell, and a DBC substrate is welded and fixed to the copper base plate. A chip, an NTC, and a diode are welded and fixed to the DBC substrate. The DBC substrate is electrically connected to power terminals mounted on the plastic shell via bonding wires. The plastic shell and a drive board are nested together, and the drive board is positioned by contacting a boss inside the plastic shell. This bare-chip integrated assembly employs a self-adjusting locking wireline connector mechanism. When the wireline connector is inserted into the mechanism, the distance between the two conductive copper plates is greater than the diameter of the insertion rod on the wireline connector, thereby reducing the resistance encountered during insertion and improving ease of connection. Furthermore, after assembly, the conductive copper plates and the insertion rod on the wireline connector are fixed and self-locked, ensuring normal conductivity and thus guaranteeing the normal operation of the device.

The invention relates to an electrical equipment support (100) comprising a body (110) equipped with sliding means (130) and a movable plate (150) received by said sliding means, having a through opening (120) for attaching said electrical equipment support to a receiving element. According to the invention, the body includes a housing (140) receiving said movable plate, in which are provided said sliding means allowing the plate mounted inside the housing to slide, and said electrical equipment support further includes elastic return means (160) acting between the plate and the body to return said plate to a predetermined rest position. The invention also relates to electrical equipment comprising such an electrical equipment support and an electrical equipment mechanism mounted on said electrical equipment support.

A cable bracket for a stacked HBA having a rack-mounted connector. In one aspect, a bracket assembly includes a bracket and a pair of rails. The bracket includes a first portion including a first segment having a first opening and a second segment having a second opening. The pair of rails includes a first rail including a first protrusion protruding from the first rail and including a first notch and a second rail including a second protrusion protruding from the second rail and including a second notch. The bracket will attach to the pair of rails when: the first portion is placed against the ends of the rails such that the first protrusion is inserted into the first opening and the second protrusion is inserted into the second opening; and the bracket is slid down such that the first opening is placed into the first notch and the second opening is placed into the second notch.

The data logger (100, 3100) includes a sensor interface for connecting at least one sensor or actuator to the data logger (100, 3100), an accessible memory (SD card) for storing data received from the at least one sensor or actuator, and a controller (3199) for controlling the operation of the data logger (100, 3100), the data logger (100, 3100) including a plurality of modules (110, 120; 3110, 3120), each module being connected to a housing of an adjacent module. The data logger has a housing electrically and mechanically connectable to the data logger, at least one module (120) functions as a logging and / or actuation module (LAM120, 3120) including a sensor interface and at least a portion of an accessible memory (SD card), and at least one module (110, 3110) connected to the at least one LAM (120, 3120) functions as a control and communications module (CCM) and includes a controller (3199) that controls internal and external communications of the data logger (100, 3100).

The invention relates to a modularly constructed control unit (100) that is specifically adaptable with regard to interface functions for an electric motor selected from a predetermined set i of electric motors, in particular electric motors of the same power class, wherein the control unit (100) has at least two printed circuit boards (L1, L2) selected from a set of N different printed circuit boards (L1, L2, ..., LN) on which interface functions, electrical components, electronic components or control units for the operation of the electric motor are located.

A mounting assembly for mounting at least two electrical modules, which are arrangeable at different levels above one another, includes: a first electrical module arrangeable on a first carrier in a first mounting plane; a second electrical module arrangeable on a second carrier in a second mounting plane arranged above the first mounting plane; a separate first support element on a first side of the first electrical module; and a separate second support element, which is axially spaced apart from the first support element, on a second side of the first electrical module. The second carrier is arrangeable spaced apart from the first carrier above the latter by the first support element and by the second support element.

Embodiments of this application provide an integrated component, a motor controller, and a powertrain. The integrated component includes an integrated housing and a capacitor core. The integrated housing is configured to accommodate the capacitor core. The integrated housing includes a first surface and a second surface that are opposite to each other in a first direction. The first surface includes two rows of fastening columns and two rows of supporting columns. Each row of the fastening columns includes a plurality of fastening columns, and each row of the supporting columns includes a plurality of supporting columns. The integrated component provided in this application has high integration and high compactness, and can reduce components and parts of the motor controller, so that a size of the motor controller is reduced.