Heat transmission and heat-dissipating structure for substrate

Abstract

The invention provides a heat transferring and radiating structure for a parent metal. The heat transferring and radiating structure is applied to transfer heat and radiate a heating element and comprises the parent metal, at least one heat conducting cylinder, a heat conducting insulated rubber layer and a conductive layer, wherein at least one hole is processed inside the parent metal, and the heat conducting cylinder is embedded into the hole. In the structure, the heat quantity of the heating element is transmitted heat and radiated through the conducting cylinder without needing the heat conducting insulated rubber layer, the heat transfer and the radiation of the heating element are realized by the design of the heat conducting cylinder so that the structure breaks through the heat transferring way of the prior parent metal plate. The heat transferring and radiating structure improves the heat conducting and radiating effects with high expansion and effectively solves the heat transfer and the radiation of the heating element.

Description

technical field [0001] The invention relates to a base material heat transfer and heat dissipation structure, in particular to a base material heat transfer and heat dissipation structure that conducts heat energy of a heating element by means of a heat conduction column and improves high-magnification heat conduction and heat dissipation effects. Background technique [0002] In the short decades of modern times, the pace of growth of various electronic products is changing with each passing day. From the past simple and bulky electronic products to the current electronic products with the characteristics of thin, light, small and powerful functions. In this way, The heating elements inside electronic products must also be developed from the low power in the past to the current high power. However, while the power of the heating elements continues to increase, the R&D personnel and the industry are facing the difficult heat transfer and heat dissipation problems of the heati...

AI Technical Summary

Problems solved by technology

Therefore, when the heating element operates to generate heat, it mainly relies on the copper foil layer to conduct the heat outward through the heat-conducting insulating adhesive layer; but because the heat-conducting insulating adhesive is not a good heat conductor, it cannot effectively transfer the heat of the heating element heat transfer outward

[0004] In view of the fact that the heat transfer and heat dissipation structure of the aforementioned heating element is not perfect, the inventor of this case is based on years of experience in research and development in this industry, hoping to provide a fundamental solution to the heat transfer problem of the heating element, and indeed can reach the industry. Utilizing the heat transfer and heat dissipation structure of the base material to serve the industry and the general public, and after a long time of research and development, the present invention was produced

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