Clamping device of sputtering substrate

Abstract

The invention relates to a sputtering substrate fixing device which is used to fix a substrate during sputtering, wherein the substrate is provided with a sputtering surface and a side surface adjacent to the sputtering surface, the sputtering substrate fixing device comprises: a base plate used to bear the substrate; a plurality of clamping units which surround the substrate and are distributed on the base plate to be propped against the substrate from the side surface of the substrate, the plurality of clamping units are a plurality of propping pieces including a base and an extension; and a plurality of fixing units which are connected with the base plate and the clamping units to fix the clamping units on the base plate. With the clamping units, the sputtering substrate fixing device fixes the substrate from the side surface of the substrate, so as to fix the substrate during sputtering, prevent the sputtering surface of the substrate from being covered during sputtering, so that the substrate has quite good sputtering effect.

Description

technical field [0001] The invention relates to a holding device, in particular to a holding device used for holding a base material in a sputtering process. Background technique [0002] Sputtering is the use of ions generated by plasma to hit the cathode target, and the atoms in the target are knocked out and deposited on the surface of the substrate to form a coating. Because sputtering can simultaneously achieve better deposition efficiency, precise composition control, and lower manufacturing cost, it is widely used in industry. The research of sputtering can refer to the paper Reduction of Plasma-Induced Gate Oxide Damage Using Low- Energy Large-Mass Ion Bombardment in Gate-Metal Sputtering Deposition. [0003] As shown in FIG. 1 , when sputtering a substrate 10 , it is generally necessary to use a holding device 1 to hold the substrate 10 . The existing holding device 1 usually includes a collar 12 and a plurality of bolts 13, by setting a plurality of screw holes ...

AI Technical Summary

Problems solved by technology

However, when using the collar 12 to fix the substrate 10, since the collar 12 exerts a pressure from the sputtering surface 10a of the substrate 10, the sputtering surface 10a of the substrate 10 will Inevitably contradict each other, which will cause the sputtering surface 10a of the substrate 10 to be sputtered due to being covered by the collar 12 when the sputtering surface 10a of the substrate 10 is being coated, thereby affecting the substrate 10. The overall sputtering effect of

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