Method and apparatus for filling type communication cable compound filling

A technology for communication cables and filling methods, applied in the direction of insulating cables, insulating conductors/cables, cables, etc., can solve the problems of unsatisfactory filling of composites, waste of raw materials, increase of manufacturing costs, etc., and achieve qualified water seepage performance, production and operation. Convenience, the effect of improving production efficiency and product quality

Active Publication Date: 2009-02-18
BEIJING HENGTONG SIBO COMM TECH CO LTD +2
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  • Abstract
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Problems solved by technology

In this way, when filling, if the temperature is low, the compound is in a semi-melted state, and the fluidity is poor, and the interior of the cable is not easy to be filled with the compound; if the temperature is high, the compound is completely melted and has good fluidity, which can ensure that the compound fills the interior of the cable However, due to the good fluidity of the compound on the surface of the cable core and the gap between the stranded units, it is easy to cause the loss of the compou...

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  • Method and apparatus for filling type communication cable compound filling

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Embodiment Construction

[0010] The present invention will be further described below in conjunction with FIG. 1 and the embodiments.

[0011] Fig. 1 is a schematic diagram of the communication cable compound filling equipment. In the figure, it includes two independent first filling systems A and second filling systems B, with a common semi-closed box 2, composed of semi-closed box 2 The partition in the middle is divided into two filling systems with the same structure, and the middle of the partition contains heat insulating material to ensure that the compound temperature of the two systems does not affect each other. A single-hole mold 12 is installed on the partition in the middle of the semi-closed box 2, and a single-hole mold 12 is also installed on the right end wall of the semi-closed box 2; in the filling system A, the unit cable 1 passes through the semi-closed box. The porous mold 11 installed on the left end wall of the box body 2 and the two ends of the first filling cavity 3 enters th...

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Abstract

The invention discloses a method and a device for filling a filling type communication cable belonging to cable machining technology range. When cabling producing large logarithm filling cable, adopting a compound section filling method of different temperatures, unit cabling lines are not firstly hinged or gathered, but are arranged in order, and through the corresponding dies, the unit cabling lines firstly enter into a first filling cavity to be filled with the compounds, after filling up with the compounds, the unit cabling lines are hinged or gathered, then enter into a second filling cavity to fill, air gaps between the unit cabling lines are filled with the compounds, thereby filling up the inner air gaps with the compounds tightly to ensure anti-water permeability of the filling type cable eligible. The invention can work continuously, improves production efficiency and product quality, and brings convenience for production and operation.

Description

technical field [0001] The invention belongs to the technical scope of cable processing, in particular to a filling method and equipment for filling communication cable compounds. Background technique [0002] At present, most filled communication cables have poor or unqualified water resistance. It is mainly caused by the insufficient filling of the filled cable compound. As we all know, the filling compound used for filled cables is an organic mixture. Therefore, the fluidity of the compound will increase with the increase of temperature, but if the temperature exceeds a certain range, the insulation performance of the compound will be reduced or even lost. Can burn the cable core. At present, the compound filling equipment for producing filled cables all have one filling cavity, and the temperature of the compound is the same when filling. In this way, when filling, if the temperature is low, the compound is in a semi-melted state, and the fluidity is poor, and the int...

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Application Information

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IPC IPC(8): H01B13/32H01B7/285
Inventor 朱卫泉苏荣申增喜甄华霞罗宇张立伟
Owner BEIJING HENGTONG SIBO COMM TECH CO LTD
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