Air supply system of semiconductor process equipment and its gas flow calibration method

Abstract

The invention discloses a gas supply system of a semiconductor processing device and a method for calibrating gas flow, the gas supply system comprises a gas path box for supplying gas to a reaction chamber, an mass flow controller (MFC) and a pipeline for cleaning the gas path box are provided on the gas path box, a calibrating isolation valve is provided on the pipeline for cleaning the gas path box and can insulate and close the pipeline for cleaning the gas path box, gas with a certain flow is supplied into the pipeline for cleaning the gas path box by the MFC, then actual flow of the gasentered into the pipeline for cleaning the gas path box can be calculated according to an ideal gas state equation, comparing with the actual flow of the gas and a setting flow of the MFC, the gas flow of the gas supply system can be calibrated based on the compared result. The costs of the system and the method are low, the calibrating times of the system and the method are short.

Description

technical field [0001] The invention relates to a semiconductor processing technology, in particular to a gas supply system of semiconductor processing equipment and a method for calibrating the gas flow. Background technique [0002] During semiconductor processing, semiconductor processing equipment supplies process gas to the reaction chamber through the gas supply system. During semiconductor processing, the flow rate of gas is an important technical indicator. MFC (mass flow controller) is installed on the gas supply pipeline. To control the gas flow, in order to ensure the accuracy of the gas flow, it is necessary to regularly check whether the MFC is offset. [0003] In prior art 1, the method for verifying the MFC is to use a dedicated MFV (Mass Flow Verifier; gas flow detection equipment) for flow calibration, wherein the MFV internally implements the gas flow verification function. [0004] The above-mentioned prior art one has at least the following disadvantages...

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Problems solved by technology

[0004] The above-mentioned prior art 1 has at least the following disadvantages: MFV needs to be purchased separately, and the value is too high, which increases the cost of semiconductor processing equipment

[0009] The above-mentioned prior art 2 has at least the following disadvantages: the time for gas calibration is long, especially when the volume of the reaction chamber is large (such as 300mm etching equipment), the time for calibration is longer

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