CMOS image sensor package

Abstract

A CMOS image sensor package is disclosed. The CMOS image sensor package includes: a substrate, on which a pre-designed circuit pattern is formed, and in which a cavity is formed; a pixel array sensor, which is electrically connected with the circuit pattern and stacked on one side of the substrate; and a control chip, which is electrically connected with the circuit pattern and held within the cavity. According to certain aspects of the invention, the CMOS image sensor chip can be separated into the pixel array sensor and the control chip, with the control chip and passive components embedded in cavities formed in the substrate, so that the size of the chip mounted on the substrate may be reduced, and consequently the overall size of the CMOS image sensor package may be reduced.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2007-0082912 filed with the Korean Intellectual Property Office on Aug. 17, 2007, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] The present application relates to a CMOS image sensor package. Background technique [0004] Image sensor chips are semiconductor devices that convert optical images into electrical signals. Examples of typical image sensor components include charge-coupled devices (CCDs) and CMOS image sensors. [0005] The CMOS image sensor sequentially detects output using a control circuit and a signal processing circuit located around MOS transistors, the number of which is equal to the number of pixels, and employing a switching technique using MOS transistors. [0006] With increasing demands for a greater variety of functions, smaller size, and lower cost in digital camera m...

AI Technical Summary

Problems solved by technology

In this way, it is possible to increase the overall size of the CMOS image sensor chips 120, 160 and the CMOS image sensor package 100

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