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Semiconductor module device, production method thereof, display device and display panel

A technology for semiconductors and flexible substrates, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., and can solve problems such as increasing the number of components and increasing the weight of devices

Inactive Publication Date: 2009-03-18
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the number of parts increases and the weight of the device increases.

Method used

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  • Semiconductor module device, production method thereof, display device and display panel
  • Semiconductor module device, production method thereof, display device and display panel
  • Semiconductor module device, production method thereof, display device and display panel

Examples

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Embodiment Construction

[0035] (Embodiment 1)

[0036] Below, use Figure 1 to Figure 6 A heat dissipation structure of a semiconductor module device according to an embodiment of the present invention will be described.

[0037] figure 1 is a cross-sectional view showing the structure of the semiconductor module device according to Embodiment 1, and figure 2 Sectional view of part A-A' when assembled from the exploded view shown. figure 2 It is an exploded perspective view showing the structure of the semiconductor module device according to the first embodiment. image 3 It is a perspective view of an assembled appearance of the semiconductor module device according to the first embodiment. Figure 4 It is an enlarged view showing a main portion of the chassis portion of the flat display panel according to Embodiment 1, and is an enlarged perspective view of a part of the chassis supporting the flat display panel of the flat display device. Figure 5 It is a perspective view showing a state...

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PUM

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Abstract

The invention aims to provides a semiconductor module device and a manufacturing method thereof and a panel display device. Metal foil 1 is provided on a surface of a flexible substrate 4 so as to be thermally connected to a semiconductor chip 5, the surface being opposed to the other surface that is in contact with a radiator 2, and the metal foil 1 is screwed to the radiator 2 with fastening screws 3a. Thus heat generated from the semiconductor chip 5 is transmitted from one surface of the semiconductor chip 5 to the radiator 2 through a heat dissipating material 5b, and the heat is transmitted from the other surface of the semiconductor chip 5 to the radiator 2 through the metal foil 1, achieving heat transfer from the two surfaces of the semiconductor chip 5 to the radiator 2. Thus it is possible to improve heat dissipation without considerably increasing the number of components or a set weight.

Description

technical field [0001] The present invention relates to a semiconductor module device in which a heat dissipation structure is added to a driving semiconductor IC (integrated circuit) chip (hereinafter referred to as a semiconductor chip) in a flat panel display device such as a color plasma display panel, and a method for manufacturing the semiconductor module device As well as a flat panel display device and a plasma display panel. Background technique [0002] Compared with liquid crystal panels, plasma display devices are attracting attention in flat panel display technology because of high-speed display, large viewing angle, ease of enlargement, and high display quality due to active light-emitting display methods. In addition, as the pitch for high-definition screens becomes finer, many semiconductor chips are required. [0003] Such a semiconductor chip needs to be mounted at a high density when mounted. However, when displaying an image, a large load is applied to t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/40H01L21/50H01L21/56G09F9/00H01J17/49H01L23/36
CPCH01L24/86H01L2924/15153H01L2924/16152H01L24/81H01L2023/4043H01L2224/81801H01L2924/14H01L24/83H01L2224/73253H01L2924/01019H01L2924/01029H01L2924/15165H01L23/3675H01L23/4985H01L2924/01078H01L2224/83H01L23/552H01L2023/4087H01L2924/3025H01L24/50
Inventor 鸟居道治下石坂望
Owner PANASONIC CORP
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