Multi-chip stacking construction having metal spacer

Abstract

A package structure stacked with a plurality of chips comprises a base plate, a first chip and a second chip, wherein the base plate is provided with a plurality of metal contacts which are mutually connected, the first surface of the first chip is fixed on the base plate through an adhesion coating, and the second surface thereof is provided with a plurality of first metal bonding pads and a plurality of second metal bonding pads, and a plurality of metal protrusions are formed on the second metal bonding pads of the first chip. The first surface of the second chip is fixed with the metal protrusions through an adhesive coating, and a plurality of metal pads are arranged on the second surface thereof, and a plurality of metal wires are used to electrically connect the first metal bonding pads on the first chip and the first metal pads on the second chip with the metal contacts on the base plate, wherein the height of the metal protrusions is larger than the largest height of the bank of the metal wires.

Description

Technical field [0001] The invention relates to an integrated circuit packaging structure and a packaging method thereof, and more particularly to a packaging structure that uses metal protrusions on a chip as a support and heat dissipation in a multi-chip stack structure. Background technique [0002] In recent years, three-dimensional (Three Dimension; 3D) packaging has been carried out in the back-end manufacturing process of semiconductors in order to use the least area to achieve higher density or memory capacity. In order to achieve this goal, a chip stacked method has been developed to achieve three-dimensional (3D) packaging. [0003] In the known technology, for example, US Patent No. 6,335,562 discloses a structure 300 that uses a metal frame 350 and a resin layer 340 to form a multi-chip stack, such as figure 1 Shown. Obviously, in figure 1 In order to prevent the metal wires 360 of the lower chip 310 from contacting the back of the upper stacked chip 320, the metal ...

AI Technical Summary

Problems solved by technology

The bead 124 does not provide the function of a pad, so that the overall die area cannot be reduced

[0005] The above-mentioned prior art still has unsatisfactory parts in actual use, so there is still room for improvement

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