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Laser processing machine

A laser processing machine and workpiece technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of longer time and lower processing efficiency, and achieve the effect of improving processing efficiency, improving processing accuracy, and simple structure

Active Publication Date: 2013-09-18
HITACHI SEIKO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the time until the end is also long, so the processing efficiency is also reduced.

Method used

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  • Laser processing machine
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Embodiment Construction

[0029] Next, an embodiment of the laser processing machine according to the present invention will be described based on the drawings. figure 1 It is an air piping diagram of the laser processing machine according to the present invention. The table 2 is configured to move freely in the XY direction, and has space portions 2A and 2B divided into two by a partition 2a inside. The surface of the table 2 is provided with a plurality of through holes 2b connected to the space portions 2A, 2B. By setting the space portions 2A, 2B to negative pressure, two workpieces can be fixed. The space parts 2A and 2B are connected to the negative pressure source 1 via the pressure switching device 6 and the hose 15. The pressure switching device 6 is directly installed under the workbench 2. The pressure gauges 5a to 5c indicate the pressure inside the space parts 2A, 2B and the hose 15. In addition, in this embodiment, although the space portion 2A, 2B inside the workbench is divided into tw...

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Abstract

The present invention provides a laser processor which can increase the processing efficiency. The laser processor is provided with a hole communicating with the internal space part at the surface of worktable (2). The workpiece is adsorbed on the worktable surface through connecting the space part with a negative pressure source. The laser processor is characterized by setting a pressure switching device (6) which connects the internal space part of the worktable with atmosphere or the negative pressure source (1) and configuring the pressure switching device (6) on the worktable. The pressure switching device (6) comprises the following components: a space part (R1) which is connected with the negative pressure source; space parts (R21, R22) communicated with the internal space part of the worktable; and pressure switching chambers (R3, R4) arranged between the space parts (R1) and (R21, R22). Furthermore the pressure switching chambers (R3, R4) are selectively communicated with one side selected from the space part (R1) or atmosphere through the valves (25a, 25b).

Description

Technical field [0001] The present invention relates to a laser processing machine in which a hole communicating with an internal space is provided on the surface of a table, and the space is connected to a negative pressure source to adsorb a workpiece to the surface of the table. Background technique [0002] Generally, a laser processing machine that processes holes on a printed circuit board (hereinafter referred to as "work") fixes the work by sucking the work on a table. Since these workpieces processed by laser drilling vary in size, conventionally, there have been proposed laser processing machines that separate the inside of the table body with partition members and can change the suction area according to the workpiece (see Patent Literature 1). Therefore, not only can the workpiece be reliably sucked to the worktable, but also the vacuum source can be operated efficiently. [0003] In addition, there is also a laser processing machine in which a plurality of laser irra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K37/04
Inventor 铃木贤司
Owner HITACHI SEIKO LTD