Frame for cleaning plastic packaging mold and method for cleaning plastic packaging mold

Abstract

The invention relates to a frame used for cleaning a plastic sealed mold. A frame body thereof adopts a hard material and is provided with at least one hollow part; the hollow part is corresponding to a cavity of the plastic sealed mold, the shape of the hollow part is similar to the shape of the working section of a plastic sealed mold cavity and the hollow area is smaller than the working section of the plastic sealed mold cavity. The invention also provides a method for cleaning the plastic sealed mold. The frame body of the invention is provided with the hollow part corresponding to the plastic sealed mold cavity; and after the plastic sealed mold is cleaned, cleaning resin is pushed out from the hollow part so as to lead the utilization rate of the frame used for cleaning the plasticsealed mold to be improved. The hollow area is smaller than the working section of the plastic sealed mold cavity, thereby being capable of leading the cleaning resin to be fixed on the frame body and to be removed together with the frame body from the plastic sealed mold, leading the cleaning resin not to be remained in the plastic sealed mold cavity and further improving the cleaning efficiency.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a frame for cleaning a plastic sealing mold and a method for cleaning the plastic sealing mold. Background technique [0002] Injection molding packages usually solder the bond pads on the chip to the corresponding pins on the lead frame through metal wires, and then pot the chip, metal wires and inner pins in a resin material so that only the leads The outer pins on the frame emerge from the potted package to assemble the electronics. [0003] Such as figure 1 As shown, after the existing chip plastic packaging mold 14 has plastic-packed the chip, there will be pollutants 10 such as plastic packaging resin and mixed chemical materials on the inner wall of the plastic packaging mold cavity 15, which must be cleaned so that the subsequent plastic packaging will not be damaged due to contamination. Affect the quality of plastic packaging. [0004] Such as figure 2 As sho...

AI Technical Summary

Problems solved by technology

[0005] Chip packaging molds are cleaned using empty lead frames which are costly and cannot be reused, resulting in waste

In order to solve the problem of high cost, Japanese patent JP2000158488 discloses a technical solution, which uses experimental paper with good heat resistance and no dust as a leadless frame for plastic mold cleaning, and makes positioning holes on the experimental paper , and then place the experimental paper on the chip plastic mold; soften the cleaning resin first, make the cleaning resin bond with the pollutants, and then harden the cleaning resin, and remove the cleaning resin and experimental paper with pollutants from Chip packaging mold cavity removal

[0006] Although the cost of using experimental paper as a frame for plastic mold cleaning is lower than that of using empty lead frames as a frame for plastic mold cleaning, experimental paper cannot be reused as a frame for plastic mold cleaning

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