Halogen-free flame-retardant photo-curing epoxy resin composition

Abstract

The invention provides a halogen free expansion flame retardant used for the flame retardation of photo-cured epoxide resin. The flame retardant consists of one or more of phosphorous compound which can generate phosphoric acid when being heated, polyol, nitrous compound and other auxiliaries; according to the 100 parts by weight of halogen free expansion flame retardant, the phosphorous compound which can generate phosphoric acid when being heated is 30 to 85 parts by weight, the polyol is 10 to 50 parts by weight, the nitrous compound is 5 to 35 parts by weight and other auxiliaries is 0 to 10 parts by weight. The invention provides a halogen free flame retardant photo-cured epoxide resin composition which has wide application range and low cost, achieves high-flame retardant effect and does not adopt an organophosphorous flame retardant.

Description

technical field [0001] The invention relates to a flame-retardant product composition, in particular to a photocurable epoxy resin composition. Background technique [0002] Halogenated (emphasis brominated) flame retardants occupy a dominant position in the field of flame retardants because of their small additions and significant flame retardant effects. However, halogenated flame retardants will produce toxic and occulting gases during the decomposition process. Therefore, people are increasingly cautious about the use of halogenated flame retardants. On July 1, 2006, the European Union began to implement the "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (referred to as the ROHS Directive), which stipulates the first batch of hazardous substances to be implemented and the list of environmental management substances of recent concern. Prohibit the use of polybrominated biphenyls (PBB), polybrominated diph...

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Problems solved by technology

[0006] Chinese patent ZL9880244.6 discloses the method of adding phosphate ester or similar to epoxy resin, however, the disadvantage of this technical solution is that due to the high water absorption and easy hydrolysis problems, the application range of this method is limited

[0007] In addition, Chinese patent ZL95196516.6 discloses the method of adding inorganic flame retardants. Although this method has a certain effect on improving the flame retardant performance of general halogen-free flame retardant epoxy resins, the improved flame retardant effect is limited, and it must be added A large amount of inorganic flame retardants can achieve high flame retardant effect (for example, the flame retardant standard of UL94V-0), and the formula disclosed in this patent uses urea-formaldehyde resin and phenolic resin, so that there is a small amount of formaldehyde in the formula, which makes it difficult to comply with ROHS Directive requirements

[0008] Chinese patent CN 1488672A discloses a reactive epoxy resin composition with high flame-retardant properties, but the preparation and production costs of the reactive flame-retardant epoxy resin are significantly higher, which is not conducive to large-scale and mass production

Its disadvantage is that its glue formula contains organophosphorus compound flame retardant, and the curing temperature of the electronic and electrical materials made of the glue is relatively high, and the curing time at high temperature is relatively long. The reliability and processing of circuit boards and other aspects bring great inconvenience

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