Ceramic / metal composite structure and manufacturing method thereof

Abstract

The invention relates to a method for manufacturing a ceramic/metal composite structure. The method comprises the following steps: providing a ceramic substrate; coating a metal interfacial layer on the ceramic substrate; placing a copper sheet on the metal interfacial layer; and heating the ceramic substrate, the metal interfacial layer and the copper sheet to allow the metal interfacial layer to combine with the ceramic substrate and the copper sheet to form a strong bond. The invention also discloses a ceramic/metal composite structure.

Description

technical field [0001] The invention relates to a ceramic / metal composite structure and a manufacturing method thereof, in particular to a composite structure formed by combining an aluminum oxide layer and a copper layer and a manufacturing method thereof. Background technique [0002] When electrons flow in electronic parts, heat will be generated, and the heat generation will increase the resistance, hinder the flow of electrons, and then greatly affect the function of electronic parts. Under the current situation that the manufacturing technology of electronic parts is greatly improved, the line width in electronic parts is getting smaller and smaller, but the circuit density is getting higher and higher, so the heat generated by electronic parts is also increasing rapidly. Taking a computer's central processing unit (Central Processing Unit, CPU) as an example, the earliest version of Intel's Pentium only needs to be packaged with a heat dissipation power of 16W. Howev...

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Problems solved by technology

This thermal stress is very large, which has a great influence on the bonding strength of the aluminum oxide sheet and the copper sheet, and after being packaged with electronic parts that generate heat, after tens of thousands of on-off cycles of the electronic parts, if the aluminum oxide sheet And th

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