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Method for processing on-state hole of multilayer printed circuit board

A technology of multi-layer printing and processing methods, which is applied in the direction of multi-layer circuit manufacturing, electrical connection formation of printed components, etc., and can solve problems such as product scrapping

Active Publication Date: 2010-11-03
靖江德方科技服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the defect that the traditional method of processing via holes in multilayer printed circuit boards is likely to cause product scrapping, and to provide a processing method that can avoid product scrapping due to the processing of via holes as much as possible

Method used

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  • Method for processing on-state hole of multilayer printed circuit board
  • Method for processing on-state hole of multilayer printed circuit board
  • Method for processing on-state hole of multilayer printed circuit board

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Embodiment Construction

[0020] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] The present invention provides a method for processing conduction holes of a multilayer printed circuit board, wherein each layer of the substrate of the multilayer printed circuit board is provided with a corresponding hole plate, and the method includes:

[0022] a. Setting multiple inspection panels in non-functional areas on one or more layers of substrates;

[0023] b. Drill inspection holes in at least one inspection panel under the control of the drilling program;

[0024] c. Check the deviation between the drilled inspection hole and the corresponding inspection panel;

[0025] d. If the deviation exceeds the allowable range, then compensate the drilling program, and then use the compensated program to drill an inspection hole on another inspection disk until the deviation between the inspection hole and the corresponding inspec...

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Abstract

The invention provides a method for processing through hole on a multi-layer printed circuit board, where the a hole disc is disposed on each substrate of the multi-layer printed circuit board. The method comprises: arranging a plurality of detection discs on one or multiple layers; drilling out detection holes on the detection discs controlled by the drilling program; checking the deviation between the detection hole and he detection disc; compensating the drilling program if the deviation falls outside the allowed range, and drilling detection hole on another detection disc until the deviation falls in the allowed range; and drilling the hole disc if the deviation falls in the allowed range. Since a detection disc only for detecting the deviation between the detection hole and the detection disc is disposed, thus, the product can not be rejected even if the deviation between the detection hole and the detection disc falls outside the allowed range.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for processing via holes of multilayer printed circuit boards. Background technique [0002] As we all know, the manufacturing method of multilayer printed circuit board mainly includes the following steps: after the inner layer substrate (such as the inner layer circuit board) is manufactured, the inner layer substrate and the outer layer substrate (such as copper foil) are combined and hot pressed; Drill via holes; metallize the via holes (such as copper plating) to realize the connection of each layer of circuits; then form the outer layer of circuits according to the via holes after copper plating; Carry out the rest of the process. [0003] In the process of drilling via holes, the hole plate pre-set on the outermost substrate (such as the outermost layer of copper foil) is usually drilled, so that the drilled via holes are accurately located in the multi-laye...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/42
Inventor 高子丰刘中秋
Owner 靖江德方科技服务有限公司
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