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Light emitting diode

A technology of light-emitting diodes and electrodes, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of reduced efficiency of phosphor powder 132, reduced light output efficiency and uniformity of light-emitting diodes 10, and achieves good uniformity and good uniformity Effect

Inactive Publication Date: 2009-06-17
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The phosphor powder 132 directly distributed around the LED chip 12 is beneficial to light mixing and improves the light uniformity of the LED 10 to a certain extent. However, when the LED 10 is working, its temperature usually reaches 70-80 degrees. , such a high temperature will easily reduce the efficiency of the phosphor 132, resulting in a reduction in the light extraction efficiency and uniformity of the light emitting diode 10.

Method used

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  • Light emitting diode
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Embodiment Construction

[0012] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0013] See figure 2 , the light emitting diode 20 provided by the first embodiment of the present invention comprises a reflective cup 21, a light emitting diode chip 22, a first electrode 23, a second electrode 24, a first scattering layer 25 and a light conversion layer 26 .

[0014] The reflector 21 includes a body 210 and a receiving groove 212 disposed on the body 210 . The body 210 includes a base 2102 and an annular sidewall 2104 disposed on the base 2102 . The accommodating groove 212 is surrounded by the base 2102 and the annular sidewall 2104 . The inner surface of the annular sidewall 2104 is used to reflect light. The accommodating groove 212 is tapered, and its opening gradually becomes larger along a direction away from the LED chip 22 .

[0015] The first electrode 23 and the second electrode 24 are disposed on the base 2102 and respective...

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Abstract

The invention relates to a light emitting diode, which comprises a reflecting cup, at least one light emitting diode chip and a plurality of electrodes, wherein the reflecting cup comprises a body and a containing groove arranged on the body, the pluralities of electrodes are arranged on the body and are located on the bottom portion of the containing groove, and the light emitting diode is arranged in the containing groove and is electrically connected with the pluralities of electrodes. The light emitting diode further comprises a first scattering layer and a light conversion layer, the first scattering layer is arranged in the containing groove and covers at least one light emitting diode chip, the first scattering layer includes scattering particles, and the light conversion layer is arranged on one side of the first scattering layer far away from the light emitting diode chip.

Description

technical field [0001] The invention relates to a light emitting diode. Background technique [0002] Currently, Light Emitting Diodes (LEDs) gradually replace Cold Cathode Fluorescent Lamps (CCFLs) as light-emitting elements of lighting devices due to their good light quality (that is, the spectrum output by the light source) and high luminous efficiency. For details, please refer to the article "Solid-State Lighting: Toward Superior Illumination" published by Michael S. Shur et al. in the document Proceedings of the IEEE, Vol.93, No.10 (October 2005). [0003] See figure 1 , a white light emitting diode 10 includes a reflective cup 11 , a light emitting diode chip 12 and a packaging body 13 for packaging the light emitting diode chip 12 . The reflective cup 11 includes an accommodating groove 110 , a positive electrode 111 and a negative electrode 112 . The accommodating groove 110 includes a bottom 1102 for accommodating the LED chip 12 , a sidewall 1104 for reflecting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/075H01L33/00
CPCH01L33/507H01L2933/0091H01L33/54H01L2224/16225H01L2224/48091H01L2224/8592H01L2924/181H01L2924/00014H01L2924/00012
Inventor 张忠民徐智鹏王君伟
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC
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