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heat sink

A heat dissipation device and heat pipe technology, applied in cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve problems such as the inability to place fixtures smoothly and inconvenient positioning of heat pipes, and achieve the effect of saving materials and realizing positioning

Inactive Publication Date: 2011-12-21
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method needs to use a positioning fixture to position the heat pipe on the predetermined position of the bottom plate, and then it can be soldered
If the area of ​​the bottom plate is small, the fixture will not be placed on the bottom plate smoothly, causing inconvenience to the positioning of the heat pipe

Method used

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Embodiment Construction

[0014] like figure 1 and 2 As shown, the heat dissipation device 10 of the present invention is used to dissipate heat from electronic components (not shown) mounted on a circuit board (not shown), and includes a bottom plate 20, a top plate 30 coupled to the bottom plate 20, and a top plate 30 coupled to the The lower fin set 50 and the upper fin set 40 of the bottom plate 20 and the top plate 30 and a plurality of heat pipes 60 sandwiched between the bottom plate 20 and the top plate 30 .

[0015] Please also refer to Figure 4 , the bottom plate 20 is integrally formed by a metal plate, and its longitudinal section is roughly "U"-shaped. The bottom plate 20 includes a flat rectangular body 22 , two sidewalls 24 vertically upwardly extending from two opposite sides of the body 22 , and two sidewalls 26 horizontally and oppositely formed from tops of the sidewalls 24 . A part of the plate body 22 punches out a square boss 220 (such as Figure 4 ) and a recess 222 located ...

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PUM

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Abstract

A heat dissipation device for dissipating heat from electronic components, comprising a bottom plate and several heat pipes placed on the bottom plate, a number of bumps are formed on the bottom plate, the arrangement of these bumps is consistent with the outline of the heat pipes so that the heat pipes are sandwiched in the meantime. Compared with the prior art, the bottom plate of the heat dissipation device of the present invention is formed with several protruding points, and these protruding points sandwich the heat pipes to realize the positioning of the heat pipes. Therefore, no groove needs to be provided on the base plate, and the thickness of the base plate can be controlled within a small range, thereby saving materials. In addition, these bumps only occupy a small area of ​​the bottom plate, which is basically not affected by the size of the bottom plate. Therefore, even if the size of the bottom plate is small, the positioning of the heat pipe can still be conveniently realized.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for dissipating heat from electronic components. Background technique [0002] In recent years, with the development of the electronics industry, the performance of electronic components has been continuously improved, and the calculation speed has become faster and faster. The calculation speed of the internal chipset has been continuously improved, the number of chips has continued to increase, and the heat emitted by the chips has also increased accordingly. If If the heat is not dissipated in time, the performance of the electronic components will be greatly affected, and the computing speed of the electronic components will be reduced. As the heat continues to accumulate, the electronic components may be burned, so the electronic components must be dissipated. [0003] A traditional heat sink includes a bottom plate and a plurality of fins extending upwa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/40H01L23/427
Inventor 赖其渊周志勇赖振田
Owner FU ZHUN PRECISION IND SHENZHEN