Image sensor and fabrication method thereof

Abstract

The present invention provides an image sensor and method for producing the same, wherein the image sensor comprises a substrate comprising a plurality of optical sensor units located therein or thereon; a plurality of optical guide structures corresponding to the plurality of optical sensor units respectively; and a stacked layer surrounding the optical guide structures, comprising a plurality of top portions with sharp corners adjacent to the top edges of the optical guide structures. The invention can not only prevent possible cross talk disturbance caused by stray light shooting into adjacent groove hence improve sensitivity of optical sensor units.

Description

technical field

[0001] The invention relates to an image sensor, and in particular to a manufacturing method of a color image sensor. Background technique

[0002] Many digital imaging devices (such as digital cameras) require image sensors, such as charge-coupled devices (CCDs) and complementary metal-oxide-semiconductor (CMOS) image sensors. An image sensor includes a two-dimensional array of photosensitive array devices (eg, photosensitive cells) that convert images into electronic signals. The display, in turn, receives signals from the photosensitive device of the image sensor and forms a representative image.

[0003] Light sensitivity is very important for an image sensor because the photosensitive device can store signals to reflect the intensity or brightness of light associated with an image.

[0004] However, reflection or refraction of light radiation in image sensing pixels is often the main cause of cross-talk in image sensors. If the reflection or refractio...

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