Fastener and heat radiating device assembly using the same
A technology for heat sinks and fasteners, applied in cooling/ventilation/heating transformation, electrical components, electrical solid devices, etc. Problems such as adverse consequences of heat dissipation to achieve the effect of ensuring the heat dissipation effect
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[0011] figure 1 and figure 2 Disclosed is a heat sink assembly in a preferred embodiment of the present invention, which is used to dissipate the heat released by electronic components (not shown) mounted on a circuit board (not shown), the heat sink assembly includes a heat sink 10 and A fastener 20 is used to fix the heat sink 10 to the circuit board and fit the electronic components.
[0012] The heat sink 10 is integrally made of high thermal conductivity materials such as copper, aluminum or alloys thereof. The heat sink 10 includes a substantially rectangular bottom plate 12 and a plurality of cooling fins 14 vertically extending upward from the bottom plate 12 . The heat dissipation fins 14 are spaced apart from each other and parallel to a pair of shorter sides of the bottom plate 12 , and a flow channel (not shown) for air flow is formed between each two adjacent heat dissipation fins 14 . A straight groove 16 is formed between two adjacent cooling fins 14a, 14b a...
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