Surface acoustic wave device and manufacturing method thereof
A technology of surface acoustic wave devices and piezoelectric substrates, which is applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., and can solve problems such as the influence of frequency characteristics
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no. 1 approach
[0023] figure 1 is a cross-sectional view of the SAW device according to the first embodiment of the present invention taken along a line so as to exhibit cross-sections of comb electrodes and column electrodes.
[0024] refer to figure 1 A SAW device 10 has a piezoelectric substrate 12 having a main surface with comb electrodes 14 and reflective electrodes (not shown for simplicity) thereon. The piezoelectric substrate 12 can be made of lithium tantalate (LiTaO 3 ) or lithium niobate (LiNbO 3 )production. The comb electrodes 14 and the reflective electrodes may be aluminum (Al) or an Al alloy to which copper (Cu) is added. Interconnect electrodes 16 are provided on the main surface of the piezoelectric substrate 12 and are electrically connected to the comb electrodes 14 . The interconnection electrode 16 may be made of Al or an Al alloy to which copper is added.
[0025] The resin portion 20 is provided on the main surface of the piezoelectric substrate 12 to define th...
no. 2 approach
[0044] The second embodiment has an exemplary structure in which an insulating film 26 is formed on the main surface of a piezoelectric substrate 12 . Figure 5 is a cross-sectional view of the SAW device according to the second embodiment taken along a line so as to exhibit a cross-section of the comb electrodes 14 and the column electrodes.
[0045] refer to Figure 5 A SAW device 10 has a piezoelectric substrate 12 having a main surface on which comb electrodes 14 , reflective electrodes (not shown), and interconnection electrodes 16 are formed. The comb electrodes 14 are electrically connected to the interconnect electrodes 16 . The resin portion 20 is located on the surface of the piezoelectric substrate 12 so as to be able to define the cavity 18 above the comb electrodes 14 . The insulating film 26 is thicker than the piezoelectric substrate 12 , and the linear expansion coefficient of the insulating film 26 is smaller than that of the piezoelectric substrate 12 in th...
no. 3 approach
[0052] The third embodiment has an exemplary structure having an insulating film 26 on both the front surface and the rear surface of the piezoelectric substrate 12 . Figure 8 is a cross-sectional view of the SAW device according to the third embodiment taken along a line so as to exhibit cross-sections of the comb electrodes 14 and the column electrodes 22 .
[0053] refer to Figure 8 A SAW device 10 has a piezoelectric substrate 12 on which comb electrodes 14 , reflective electrodes (not shown), and interconnect electrodes 16 are formed. The comb electrodes 14 are electrically connected to the interconnect electrodes 16 . The resin portion 20 is formed on the main surface of the piezoelectric substrate 12 so that the cavity 18 can be defined above the comb electrodes 14 . An insulating film 26 is formed on the main surface of the piezoelectric substrate 12 to cover the resin portion 20 . The column electrodes 22 are provided on the interconnect electrodes 16 so as to pe...
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