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Polishing pad having micro-grooves on the pad surface

A polishing pad and micro-grooving technology, applied in the field of polishing pads, can solve the problems of aggravated planarization non-uniformity, changes in size, shape and rough peak distribution, and lack of good control.

Active Publication Date: 2012-10-10
INNOPAD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the tuning process can be unstable because it utilizes sharp diamond grains to cut off the deformed rough peaks
The shearing off of deformed asperity peaks may not be well controlled, leading to variations in size, shape, and distribution of asperity peaks, which in turn cause variations in planarization uniformity
Moreover, tuning the generated frictional heat can also exacerbate planarization inhomogeneity by changing the surface properties of the pad, including, for example, shear modulus, hardness, and compressibility

Method used

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  • Polishing pad having micro-grooves on the pad surface
  • Polishing pad having micro-grooves on the pad surface
  • Polishing pad having micro-grooves on the pad surface

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Embodiment Construction

[0018] The present disclosure relates to a polishing pad that provides a relatively high surface density of microgrooves. The microgrooves may be autogenous, ie they may not be created by the mechanical surface cutting action of the diamond conditioning devices used in CMP as described above. Rather, they can be formed by exposing soluble components of specific dimensions in the surface region of the polishing pad to an aqueous slurry. Furthermore, the microgrooves and their orientation in the pad surface area can be designed and optimized to meet the requirements of a particular CMP application. Thus, the arrangement of microgrooves can be designed to be non-directional or can be oriented completely randomly, or can provide the specific pattern needed to optimize planarization for a given microchip design.

[0019] The microgrooves can have widths and depths up to about 150 microns, and for example, in the range of 5 to 150 microns (0.0002 to 0.006 inches), including all val...

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Abstract

A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and / or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Application No. 60 / 831,595, filed July 19,2006. technical field [0003] The present invention relates to a polishing pad, and more particularly, to a polishing pad including microgrooves capable of self-regenerating during polishing. The pad can be used for chemical mechanical polishing or other types of polishing of a given substrate, such as a semiconductor wafer. Background technique [0004] When applying CMP (Chemical Mechanical Planarization) as a processing step in the manufacture of microelectronic devices such as semiconductor wafers, covered silicone wafers, and computer hard drives, polishing pads can be combined with abrasive or non-abrasive-containing slurries. ) is used to affect the planarization of the device surface. In order to obtain a high degree of planarization of the device surface, typically measured in Angstroms, the slurry flow should be e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00B24D11/00
CPCB24B37/26B24B37/24B24B1/00B24D11/00
Inventor 许启智M·C·金D·A·韦尔斯J·E·奥尔德伯勒
Owner INNOPAD