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Chip type rubidum lamp
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A chip and rubidium lamp technology, applied in the field of high-frequency light-emitting devices, can solve the problems of high power consumption, inconvenience to carry, large size, etc., and achieve the effect of reducing power consumption
Inactive Publication Date: 2010-08-25
XIAMEN UNIV
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[0010] The purpose of the present invention is to provide a chip-type rubidium lamp with small volume, low power consumption and easy to carry in view of the shortcomings of existing rubidium lamps such as large volume, high power consumption, and inconvenient portability.
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Embodiment 1
[0022] Referring to Fig. 1~3, the present invention is a three-layer structure, is provided with upper layer glass sheet 1, middle layer silicon sheet 2 and lower layer silicon sheet 3 from top to bottom, is provided with a through hole 8 in the center of middle layer silicon sheet 2, in through hole 8 is provided with a channel 4 on one side, the through hole 8 communicates with the outside through the channel 4, and an inductance coil 5 is provided on the bottom surface of the lower silicon chip 3, and the two ends of the inductance coil 5 are respectively provided with an external joint 6 and an internal joint 7. The connector 6 and the inner connector 7 are externally connected to a radio frequency power supply. Bond the upper surface of the upper glass sheet 1, the middle silicon sheet 2 and the lower silicon sheet 3 to form a chip, and fill the cavity formed between the through hole 8 in the center of the middle silicon sheet 2 and the upper glass sheet 1 and the lower si...
Embodiment 2
[0025] Similar to Example 1, the difference is that the cavity formed between the through hole in the center of the middle silicon chip and the upper glass sheet and the lower silicon chip is first filled with rubidium-87, and then filled with nitrogen. The amount of rubidium-87 charged is 10 mg, and the pressure of nitrogen gas charged is 10 Tor.
[0026] The shape and size of the upper glass sheet and the lower silicon chip on both sides of the middle layer silicon chip are the same as the middle layer silicon chip, the middle layer silicon chip is a rectangular silicon chip, the thickness of the middle layer silicon chip is 1 ~ 2mm, and the side length It is 15-20mm. The upper glass sheet is a rectangular glass sheet, and the side length of the rectangular glass sheet is 15-20 mm. The lower silicon wafer is a rectangular silicon wafer, and the side length of the rectangular silicon wafer is 15-20 mm. The through hole is a rectangular through hole, and the side length of t...
Embodiment 3
[0028] Similar to Example 1, the difference is that the cavity formed between the through hole in the center of the middle silicon chip and the upper glass sheet and the lower silicon chip is firstly filled with rubidium-87, and then filled with argon. The amount of rubidium-87 charged is 1 mg, and the gas pressure of the charged argon is 200 Tor.
[0029] The shape and size of the upper layer glass sheet and the lower layer silicon chip on both sides of the middle layer silicon chip are the same as the middle layer silicon chip, the middle layer silicon chip is a rectangular silicon chip, the thickness of the middle layer silicon chip is 0.5 ~ 1mm, the side length 10-15mm. The upper glass sheet is a rectangular glass sheet, and the side length of the rectangular glass sheet is 10-15 mm. The lower silicon wafer is a rectangular silicon wafer, and the side length of the rectangular silicon wafer is 10-15 mm. The through hole is a rectangular through hole, and the side length ...
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Abstract
The invention provides a chip type rubidum lamp which relates to a high frequency light-emitting device, in particular to the chip type rubidum lamp which can be used for a microminiaturization and chThe invention provides a chip type rubidum lamp which relates to a high frequency light-emitting device, in particular to the chip type rubidum lamp which can be used for a microminiaturization and chcon slice on the lower layer, both ends of the electric induction coil are respectively provided with a union joint, and the two union joints are externally connected with a radio-frequency power suppcon slice on the lower layer, both ends of the electric induction coil are respectively provided with a union joint, and the two union joints are externally connected with a radio-frequency power supply; and the upper surfaces of the sheet glass on the upper layer, the silicon slice on the middle layer and the silicon slice on the lower layer are integrated into one chip in a linkage way, and cavily; and the upper surfaces of the sheet glass on the upper layer, the silicon slice on the middle layer and the silicon slice on the lower layer are integrated into one chip in a linkage way, and cavities formed by the through hole on the center of the silicon slice on the middle layer, and the sheet glass on the upper layer and the silicon slice on the lower layer are filled with rubidium-87 inerties formed by the through hole on the center of the silicon slice on the middle layer, and the sheet glass on the upper layer and the silicon slice on the lower layer are filled with rubidium-87 inert gas.t gas.ip type rubidum atomic clock and various traditional and conventional rubidum atomic clocks, can be used as a light source, and can also be widely used for various circumstances demanding energy savinip type rubidum atomic clock and various traditional and conventional rubidum atomic clocks, can be used as a light source, and can also be widely used for various circumstances demanding energy saving and low power consumption. The invention provides the chip type rubidum lamp having smaller volume as well as power consumption and portability. The chip type rubidum lamp is of a three-layer structg and low power consumption. The invention provides the chip type rubidum lamp having smaller volume as well as power consumption and portability. The chip type rubidum lamp is of a three-layer structure, and is provided with an upper sheet glass layer, a middle silicon slice layer and a lower silicon slice layer, wherein a through hole is arranged at the center of a silicon slice on the middle laure, and is provided with an upper sheet glass layer, a middle silicon slice layer and a lower silicon slice layer, wherein a through hole is arranged at the center of a silicon slice on the middle layer, a channel is arranged on one side of the through hole, and the through hole is communicated with the outside by the channel; an electric induction coil is arranged on the bottom surface of a siliyer, a channel is arranged on one side of the through hole, and the through hole is communicated with the outside by the channel; an electric induction coil is arranged on the bottom surface of a sili
Description
technical field [0001] The present invention relates to a high-frequency light-emitting device, in particular to a device that can be used not only for miniaturization and chip-type rubidium atomic clocks, but also for various traditional rubidium atomic clocks, and can also be widely used as a light source It is suitable for various chip-type rubidium lamps that require energy-saving and low-power consumption light sources. Background technique [0002] With the development of modern science and technology, many fields such as satellite communication technology, global satellite positioning system (GPS), radar system, traffic control system and power dispatching need more stable and accurate time and frequency signals. Traditional mechanical timing and crystal oscillator timing It can no longer meet the needs. Atomic frequency standards, also known as atomic clocks, have extremely high stability and accuracy, and have been used more and more widely. Among them, the rubidi...
Claims
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Application Information
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