Semiconductor device and manufacturing method of the same

Abstract

The present invention provides a semiconductor device and manufacturing method of the same, the method includes steps of: preparing a substrate (172), a clintheriform terminal stand (182) arranged in interval with the substrate (172) to form through holes from a side to the other, and a control terminal (153) built in the through holes and projecting from the terminal stand (182); preparing a first and second metal moulds, the former forming a first concave section of the first metal mould for containing the substrate (172), and the latter forming a second concave section of the second metal mould for containing the terminal stand (182) and a third concave section of the second metal mould for containing the control terminal (153) projecting from the terminal stand (182); configuring the substrate (172) in the first concave section; configuring the terminal stand (182) in the second concave section and configuring the control terminal (153) in the third concave section, and sealing opening of the second concave section of the stand (182); filling resin between the substrate (172) and the terminal stand (182) to form mould resin (174) on the substrate (172) in state that the first and second metal moulds clamping the periphery of the terminal stand (182).

Description

technical field [0001] 0001 [0002] The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device, and more particularly to a semiconductor device in which elements on a substrate are covered with a resin and a method of manufacturing the semiconductor device. Background technique [0003] 0002 [0004] Conventionally, semiconductor devices processed in various ways have been proposed. For example, the electronic circuit device described in JP-A-07-022722 includes: an electronic circuit substrate; electronic components mounted on the electronic circuit substrate; Bonded into one protective resin. The protective resin is composed of a thermosetting resin material mixed with epoxy resin mixed with inorganic powder and a curing agent to cure the resin body, and it is difficult to elastically deform easily. [0005] 0003 [0006] The electrical / electronic module described in JP-A-2004-111435 has an electronic circuit substra...

AI Technical Summary

Problems solved by technology

[0040] In the semiconductor device described in Japanese Unexamined Patent Application Publication No. 2001-237252, a molding resin composed only of epoxy resin or the like is formed on the semiconductor substrate and the mounting element, and when connecting the terminals and the like, once a predetermined or more external force is applied, it is easy to Cracks etc.

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