38results about How to "Avoid preparation method" patented technology

When an antireflection film is used when forming the two-stage stepped opening on the interlayer insulating film, it is possible to obtain a semiconductor device manufacturing method capable of preventing a decrease in reliability. The manufacturing method of this semiconductor device comprises the steps of forming a first resist pattern on a predetermined region on an antireflective film, using the first resist pattern as a mask to form a first opening in an interlayer insulating film, leaving After removing the first anti-corrosion pattern on the anti-reflection film, in the predetermined area on the anti-reflection film, the process of forming the second anti-corrosion pattern, using the second anti-corrosion pattern as a mask, at least on the top of the first opening, A step of forming a second opening having a larger opening area than the first opening.

To obtain a method for manufacturing an electronic device having a wiring connection structure which can avoid improper contact between a via plug and a metal wiring. In an etching step for forming a via hole 8, mixture gas of C4H8, O2, and Ar is used an etching gas. This enables the surface of the side wall of the via hole 8 to be smooth without fine irregularity at least in the upper part of the side wall 8. Thus, a barrier metal film 9 and the side wall of the via hole 8 can be tightly contacted with each other without causing a gap therebetween caused by the fine irregularity. As a result, in a cleaning step using a hydrofluoric acid after a CMP (chemical mechanical polishing) step, a cleaning solution can be avoid from passing through the gap between the film 9 and the side wall of the via hole 8 and being impregnated into the film 3.

The invention discloses a method for preparing amorphous/crystal composite structure aluminium-based alloy. The composition is as follows: Al(84-x)Ni10Ce6Prx (in percentage by weight), or Al(84-x)Ni10Ce6Zrx (in percentage by weight), wherein x is equal to 1 to 4. The method for preparing the amorphous/crystal composite structure aluminium-based alloy comprises the following steps: during the processes of fast solidifying aluminium-based alloy melt and preparing the amorphous alloy, applying stable and constant magnetic field action on a melt solidification process; and controlling the forming of the solidified tissue structure of the alloy, thus obtaining amorphous/crystal composite structure materials. The intensity of the applied stable and constant magnetic field ranges from 900Gs to 1,200Gs; the selected alloy is alloy capable of forming complete amorphous tissues, parent alloy is prepared through vacuum arc melting or vacuum induction melting according to composition distribution, then the stable and constant magnetic field is applied on the melt solidifying process, and the amorphous/crystal composite structure materials are prepared according to the preparation technique of fast solidifying alloy melt and preparing the amorphous alloy. The invention provides a method for directly preparing the amorphous/crystal composite structure tissues, the phase distribution of crystals in the prepared amorphous/crystal composite structure is uniform, the preparation process ensures that the original preparation technique is not changed, and the technique process is simple.

A Production method of a fiber reinforced product capable of preventing electromagnetic wave interference comprises the following steps: (A) mutually stacking multi layers of a fiber reinforced material and a metal material; and (B) hot pressing the multi layers of the fiber reinforced material and the metal material into a fiber reinforced product by using a hot press die. Through mutual stacking and one-body hot pressing molding of the metal material and the fiber reinforced material, not only the operating procedure and work time can be effectively reduced so as to reduce the production cost and time, also the thickness of the metal material can be effectively controlled, so that the overall electromagnetic shielding effect is consistent.

The invention relates to a heat dissipation device and a manufacturing method thereof. The heat dissipation device comprises a substrate and at least one heat pipe which is arranged in a containing hole of the substrate. Two sides of the heat pipe are pressed and deformed to be close to the two opposite inner walls in the containing hole, thus the substrate and the heat pipe are closely combined to be a whole body, the problem that a known hole needs secondary processing and the back side flatness is poor due to processing are solved, and the effects of cost saving and uniform temperature can be achieved at the same time.

A mask forming composition including: a silicon compound; a metal compound including an alkaline earth metal or an alkaline metal; and a dispersion medium.

The present invention addresses the problem of providing a touch panel sensor and a method of manufacture thereof capable of preventing touch sensitivity reduction due to elongation of a touch sensoreffective region, and also capable of avoiding inserting a region that does not contribute to touch detection into the touch sensor effective region. The problem is solved by a touch panel sensor thathas, provided on one surface of a substrate thereof, a first sensor group (20) comprising a plurality of sensor channels (2), and that also has, provided on the opposite surface of the substrate, a second sensor group (40) comprising a plurality of sensor channels (4), wherein: the plurality of sensor channels (2) and the plurality of sensor channels (4) are disposed to extend in directions to intersect each other; the first sensor group (20 and the second sensor group (40) form a rectangular touch sensor effective region (S); and the equation x <= y < alfa is satisfied, where x is the sensorlength of the longest of the plurality of sensor channels (2), y is the sensor length of the longest of the plurality of sensor channels (4), and alfa is the length of the long sides of the touch sensor effective region (S).

The invention provides a method for preparing sesame-seed cake meal protein isolate. The sesame-seed cake meal protein isolate is prepared from low-temperature sesame-seed cake meal and 10-20 parts of pure water in an extraction manner. The method for preparing the sesame-seed cake meal protein isolate comprises the following steps: preparing 40-80-mesh low-temperature sesame-seed cake meal and pure water into a 5-10% solution, adding an alkali liquid, adjusting the pH value to be 7.0-10.0, performing centrifugal separation, recycling the liquid phase, adding hydrochloric acid into the obtained liquid phase to adjust the pH to be 4.0-4.6, adding pure water into the obtained solid phase for washing, uniformly stirring, adding the alkali liquid to neutralize until the pH value is 6.0-9.0, and performing spray drying, thereby obtaining sesame-seed cake meal protein isolate. The recycling rate of protein is greater than 90%, and the content of protein of a product is greater than 80%.

The invention provides white photosensitive solder resist ink, which comprises a main agent and a curing agent, the main agent comprises alkali development type photosensitive resin, titanium dioxide and a photoinitiator, and in the main agent and the curing agent, the total content of nitrogen, phosphorus and sulfur is less than 2000ppm. The invention provides solder resist ink capable of avoiding silica gel poisoning, a preparation method of the solder resist ink, a solder resist layer and a Mini-LED printed circuit board.