The invention discloses a
flip chip failure analysis method and a preparation method of a detection sample in electric property positioning. The preparation method includes the steps that a
flip chip to be detected is provided, wherein the
flip chip comprises a packaging substrate and a bare
chip prepared on the packaging substrate, the bare
chip is covered with a plastic
package body, a gold bump is connected between the bare
chip and the packaging substrate, and a
solder ball is welded to the bottom of the packaging substrate; the plastic
package body outside the bare chip is ground till the
crystal back of the bare chip is exposed; the back face of the bare chip is combined to a glass base plate, and a conducting strip is arranged on the glass base plate; the conducting strip on the glass base plate is electrically connected with the
solder ball at the bottom of the packaging substrate through a packaging binding wire, and then the detection sample is obtained. According to the preparation method of the detection sample for flip chip
failure analysis, the plastic
package body on the back face of the bare chip is ground away, then the back face of the bare chip is combined on the glass base plate for
failure analysis, the plastic package body does not need to be corroded, the packaging substrate and the bare chip do not need to be separated, and therefore the probability that the gold bump is corroded in the bare chip taking process is avoided.